EP 4078663 A1 20221026 - METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
Title (en)
METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
Title (de)
VERFAHREN ZUM BONDEN VON CHIPS MIT EINEM SUBSTRAT DURCH DIREKTES BONDEN
Title (fr)
PROCÉDÉ DE COLLAGE DE PUCES À UN SUBSTRAT PAR COLLAGE DIRECT
Publication
Application
Priority
- FR 1914956 A 20191219
- EP 2020086664 W 20201217
Abstract (en)
[origin: CA3161399A1] The method for bonding chips (100) to a substrate (101) by direct bonding comprises a step of providing a medium (105) where the chips (100) are in contact, the chips (100) which contact with the medium (105) being customised. Said bonding method comprises: - a step of forming a liquid film (103) on one face (104) of the substrate (101), - a step of bringing the chips (100) into contact with the liquid film (103), the contact between the chips (100) and the liquid film (103) causing the chips (100) to be attracted to the substrate (101), - a step of evaporating the liquid film (103) to bond the chips (100) to the substrate (101) by direct bonding.
IPC 8 full level
H01L 21/60 (2006.01)
CPC (source: EP US)
H01L 21/6835 (2013.01 - EP); H01L 21/6836 (2013.01 - EP); H01L 24/08 (2013.01 - US); H01L 24/74 (2013.01 - US); H01L 24/80 (2013.01 - US); H01L 24/95 (2013.01 - EP); H01L 25/0655 (2013.01 - US); H01L 25/50 (2013.01 - EP); H01L 24/74 (2013.01 - EP); H01L 24/80 (2013.01 - EP); H01L 24/97 (2013.01 - EP); H01L 2221/68309 (2013.01 - EP); H01L 2221/68313 (2013.01 - EP); H01L 2221/68354 (2013.01 - EP); H01L 2221/68386 (2013.01 - EP); H01L 2224/08221 (2013.01 - US); H01L 2224/75317 (2013.01 - EP); H01L 2224/7565 (2013.01 - EP); H01L 2224/75824 (2013.01 - EP); H01L 2224/7598 (2013.01 - EP); H01L 2224/80004 (2013.01 - EP US); H01L 2224/80011 (2013.01 - EP); H01L 2224/80013 (2013.01 - EP); H01L 2224/80085 (2013.01 - US); H01L 2224/80136 (2013.01 - EP); H01L 2224/80143 (2013.01 - EP); H01L 2224/80395 (2013.01 - US); H01L 2224/80894 (2013.01 - EP); H01L 2224/94 (2013.01 - EP); H01L 2224/95001 (2013.01 - EP); H01L 2224/95136 (2013.01 - EP); H01L 2224/95146 (2013.01 - EP); H01L 2224/97 (2013.01 - EP)
Citation (search report)
See references of WO 2021122909A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
FR 3105569 A1 20210625; FR 3105569 B1 20211217; CA 3161399 A1 20210624; CN 115136287 A 20220930; EP 4078663 A1 20221026; JP 2023508867 A 20230306; US 2023029338 A1 20230126; WO 2021122909 A1 20210624
DOCDB simple family (application)
FR 1914956 A 20191219; CA 3161399 A 20201217; CN 202080096933 A 20201217; EP 2020086664 W 20201217; EP 20823879 A 20201217; JP 2022537366 A 20201217; US 202017786000 A 20201217