Global Patent Index - EP 4079114 A1

EP 4079114 A1 20221026 - CIRCUIT BOARD HAVING A SURFACE-MOUNTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAID CIRCUIT BOARD

Title (en)

CIRCUIT BOARD HAVING A SURFACE-MOUNTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAID CIRCUIT BOARD

Title (de)

LEITERPLATTE MIT EINEM OBERFLÄCHENMONTIERTEN ELEKTRONISCHEN BAUTEIL UND VERFAHREN ZU DEREN HERSTELLUNG

Title (fr)

CARTE DE CIRCUIT IMPRIMÉ PRÉSENTANT UN COMPOSANT ÉLECTRONIQUE MONTÉ EN SURFACE ET PROCÉDÉ DE FABRICATION DE LADITE CARTE DE CIRCUIT IMPRIMÉ

Publication

EP 4079114 A1 20221026 (DE)

Application

EP 20820456 A 20201214

Priority

  • EP 19218479 A 20191220
  • EP 2020085927 W 20201214

Abstract (en)

[origin: WO2021122428A1] The invention relates to a circuit board (10), comprising at least one electronic component (20) mounted on an exterior (11) of the circuit board (10). A plastic film (30), which has a film thickness (31) and a plurality of openings (32), is arranged between the at least one electronic component (20) and the exterior (11) of the circuit board (10) that is allocated to the component (20). The plastic film (30) is fastened to the exterior (11) of the circuit board (10). The openings (32) in the plastic film (30) are at least partially filled with conductive adhesive (50), and said openings (32) are positioned at the placement position (29) of the component (x) such that a conducting track portion (12) on the exterior (11) of the circuit board (10) is conductively connected to a contact pad (25) on the bottom (21) of the at least one component (20) by means of the conductive adhesive (50) within an opening (32). The invention further relates to a method for producing a circuit board (10) of this type.

IPC 8 full level

H05K 3/28 (2006.01); H05K 3/32 (2006.01)

CPC (source: EP)

H05K 3/281 (2013.01); H05K 3/321 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/10575 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/0186 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/0278 (2013.01); Y02P 70/50 (2015.11)

Citation (search report)

See references of WO 2021122428A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 3840549 A1 20210623; CN 218388141 U 20230124; EP 4079114 A1 20221026; WO 2021122428 A1 20210624

DOCDB simple family (application)

EP 19218479 A 20191220; CN 202090001019 U 20201214; EP 2020085927 W 20201214; EP 20820456 A 20201214