Global Patent Index - EP 4094552 A1

EP 4094552 A1 20221130 - DEVICE FOR COOLING AN ELECTRICAL AND/OR ELECTRONIC COMPONENT LIABLE TO RELEASE HEAT DURING OPERATION

Title (en)

DEVICE FOR COOLING AN ELECTRICAL AND/OR ELECTRONIC COMPONENT LIABLE TO RELEASE HEAT DURING OPERATION

Title (de)

VORRICHTUNG ZUR KÜHLUNG EINES ELEKTRISCHEN UND/ODER ELEKTRONISCHEN BAUTEILS, DAS WÄHREND DES BETRIEBS WÄRME ABGEBEN KANN

Title (fr)

DISPOSITIF DE REFROIDISSEMENT D'UN COMPOSANT ÉLECTRIQUE ET/OU ÉLECTRONIQUE SUSCEPTIBLE DE DÉGAGER DE LA CHALEUR EN FONCTIONNEMENT

Publication

EP 4094552 A1 20221130 (FR)

Application

EP 21706639 A 20210121

Priority

  • FR 2000573 A 20200121
  • FR 2021050107 W 20210121

Abstract (en)

[origin: WO2021160948A1] The invention relates to a thermal management device (1) for the thermal management of an electrical and/or electronic component (2) liable to release heat during its operation, said device (1) comprising a casing (3), said casing (3) comprising a main compartment (4) defining at least one housing (5) able to accept said electrical and/or electronic component (2), said housing (5) being designed to receive a dielectric fluid and being delimited by at least one wall (6), characterized in that said wall (6) comprises a partition (7) defining within the housing a first (51) and a second (52) chamber of dielectric fluid, said partition (7) comprising an opening (8) that is arranged in such a way that, when the the electrical and/or electronic component (2) is placed in the housing (5), this electrical and/or electronic component extends on both sides of said partition (7) so that this electrical and/or electronic component (2) extends into both of the two chambers (51, 52).

IPC 8 full level

H05K 7/20 (2006.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/6567 (2014.01); H01M 10/6569 (2014.01); H01M 50/20 (2021.01)

CPC (source: EP US)

H01M 10/613 (2015.04 - EP US); H01M 10/625 (2015.04 - EP); H01M 10/6567 (2015.04 - EP US); H01M 10/6569 (2015.04 - EP); H01M 50/20 (2021.01 - EP); H05K 7/20236 (2013.01 - EP); H05K 7/20272 (2013.01 - US); Y02E 60/10 (2013.01 - EP)

Citation (search report)

See references of WO 2021160948A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

FR 3106438 A1 20210723; FR 3106438 B1 20220128; CN 115280910 A 20221101; EP 4094552 A1 20221130; US 2023061262 A1 20230302; WO 2021160948 A1 20210819

DOCDB simple family (application)

FR 2000573 A 20200121; CN 202180010458 A 20210121; EP 21706639 A 20210121; FR 2021050107 W 20210121; US 202117794292 A 20210121