EP 4095591 A4 20240417 - ELECTRONIC DEVICE, ELECTRONIC COMPONENT, CONTACTLESS ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Title (en)

ELECTRONIC DEVICE, ELECTRONIC COMPONENT, CONTACTLESS ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Title (de)

ELEKTRONISCHE VORRICHTUNG, ELEKTRONISCHES BAUELEMENT, KONTAKTLOSE ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG

Title (fr)

DISPOSITIF ÉLECTRONIQUE, COMPOSANT ÉLECTRONIQUE, DISPOSITIF ÉLECTRONIQUE SANS CONTACT, ET PROCÉDÉ DE FABRICATION DE DISPOSITIF ÉLECTRONIQUE

Publication

EP 4095591 A4 20240417 (EN)

Application

EP 21776130 A 20210125

Priority

JP 2020056249 A 20200326
JP 2021002465 W 20210125

Abstract (en)

[origin: EP4095591A1] An electronic device includes a plurality of devices, wiring electrically connecting each of the devices, and a substrate on which the wiring is formed and a slit is formed. Preferably, the substrate is bent to follow a predetermined curved surface. Preferably, the slit is formed so as to extend in a direction substantially orthogonal to a gradient vector with respect to a predetermined direction at each point on the predetermined surface. Thus, provided is an electronic device capable of preventing deterioration in reliability, when a substrate is bent to follow any curved surface.

IPC 8 full level

G02C 7/04 (2006.01); B29D 11/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP US)

B29D 11/00038 (2013.01 - EP); B29D 11/00826 (2013.01 - EP); G02C 7/04 (2013.01 - EP US); G02C 11/10 (2013.01 - US); H05K 1/028 (2013.01 - US); H05K 3/0011 (2013.01 - US); H05K 1/028 (2013.01 - EP); H05K 1/189 (2013.01 - EP); H05K 2201/09063 (2013.01 - EP US)

Citation (search report)

[X] US 2010072643 A1 20100325 - PUGH RANDALL B [US], et al
[X] US 2014321126 A1 20141030 - NARAG ALEJANDRO ALDRIN II AGCAOILI [SG], et al
[X] US 9696564 B1 20170704 - ETZKORN JAMES [US], et al
[XI] EP 2979622 A1 20160203 - OPHTIMALIA [FR]
See also references of WO 2021192571A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 4095591 A1 20221130; EP 4095591 A4 20240417; JP WO2021192571 A1 20210930; US 2023314842 A1 20231005; WO 2021192571 A1 20210930

DOCDB simple family (application)

EP 21776130 A 20210125; JP 2021002465 W 20210125; JP 2022509321 A 20210125; US 202117912586 A 20210125