Global Patent Index - EP 4100228 A1

EP 4100228 A1 20221214 - LOW-PRESSURE MOLDING SYSTEM

Title (en)

LOW-PRESSURE MOLDING SYSTEM

Title (de)

NIEDERDRUCKGIESSANLAGE

Title (fr)

SYSTÈME DE MOULAGE BASSE PRESSION

Publication

EP 4100228 A1 20221214 (EN)

Application

EP 21710663 A 20210209

Priority

  • US 202062972053 P 20200209
  • US 2021017256 W 20210209

Abstract (en)

[origin: WO2021159122A1] The present invention relates to extrusion molding machines and methods of producing extrusion molded parts and, more particularly, to extrusion molding machines that adjust operating parameters of the extrusion molding machine during an extrusion molding run to account for changes in material properties and pressures of the extrusion material and methods of accounting for changes in extrusion molding material properties during an extrusion molding run and/or compounding of materials.

IPC 8 full level

B29C 45/77 (2006.01); B29C 45/00 (2006.01)

CPC (source: EP GB)

B29C 45/0001 (2013.01 - GB); B29C 45/77 (2013.01 - EP GB); B29C 2945/76498 (2013.01 - EP GB); B29C 2945/76859 (2013.01 - EP GB); B29K 2995/0012 (2013.01 - EP GB)

Citation (search report)

See references of WO 2021159122A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2021159122 A1 20210812; WO 2021159122 A4 20211125; WO 2021159122 A8 20211014; CA 3166795 A1 20210812; EP 4100228 A1 20221214; GB 202213037 D0 20221019; GB 2607831 A 20221214; JP 2023513686 A 20230403; MX 2022009758 A 20230313

DOCDB simple family (application)

US 2021017256 W 20210209; CA 3166795 A 20210209; EP 21710663 A 20210209; GB 202213037 A 20210209; JP 2022548217 A 20210209; MX 2022009758 A 20210209