EP 4101011 A1 20221214 - METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE COMPRISING AT LEAST ONE SUPERCONDUCTIVE ZONE AND ASSOCIATED DEVICE
Title (en)
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE COMPRISING AT LEAST ONE SUPERCONDUCTIVE ZONE AND ASSOCIATED DEVICE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG MIT MINDESTENS EINER SUPRALEITENDEN ZONE UND ZUGEHÖRIGE VORRICHTUNG
Title (fr)
PROCÉDÉ DE FABRICATION D'UN DISPOSITIF ÉLECTRONIQUE COMPORTANT AU MOINS UNE ZONE SUPRACONDUCTRICE ET DISPOSITIF ASSOCIÉ
Publication
Application
Priority
- FR 2001126 A 20200205
- EP 2021052684 W 20210204
Abstract (en)
[origin: WO2021156378A1] The invention relates to a method for manufacturing a device, the device comprising a superconductive zone (20) and an insulating zone (22) in accordance with an arrangement, comprising the steps of: - depositing a buffer layer (12) on a portion of a substrate (10), - etching the buffer layer (12) in order to obtain two zones (Z1, Z2), each first zone (Z1) being a zone in which the substrate (10) is covered by the buffer layer (12) and which is intended to form a respective superconductive zone (20), each second zone (Z2) being a zone in which the substrate (10) is exposed to form a respective insulating zone (22), and - depositing a second layer (18) of superconductive material on the whole of the portion of the substrate (10), the first layer (12) being constructed in the form of at least two superimposed sub-layers (14, 16).
IPC 8 full level
H10N 60/01 (2023.01); H10N 60/81 (2023.01)
CPC (source: EP US)
H10N 60/0268 (2023.02 - EP); H10N 60/0688 (2023.02 - EP); H10N 60/0912 (2023.02 - EP US); H10N 60/12 (2023.02 - US); H10N 60/815 (2023.02 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
FR 3106935 A1 20210806; FR 3106935 B1 20220114; AU 2021217549 A1 20220915; EP 4101011 A1 20221214; US 2023051835 A1 20230216; WO 2021156378 A1 20210812
DOCDB simple family (application)
FR 2001126 A 20200205; AU 2021217549 A 20210204; EP 2021052684 W 20210204; EP 21702682 A 20210204; US 202117797794 A 20210204