Global Patent Index - EP 4105250 A4

EP 4105250 A4 20240228 - RESIN COMPOSITION FOR STEREOLITHOGRAPHY

Title (en)

RESIN COMPOSITION FOR STEREOLITHOGRAPHY

Title (de)

HARZZUSAMMENSETZUNG FÜR STEREOLITHOGRAFIE

Title (fr)

COMPOSITION DE RÉSINE POUR STÉRÉOLITHOGRAPHIE

Publication

EP 4105250 A4 20240228 (EN)

Application

EP 21754607 A 20210209

Priority

  • JP 2020020826 A 20200210
  • JP 2021004832 W 20210209

Abstract (en)

[origin: EP4105250A1] The present invention provides a resin composition for stereolithography that excels in strength, toughness, and water resistance in the form of a shaped article. The present invention relates to a resin composition for stereolithography that comprises a urethanized (meth)acrylic compound (A), a (meth)acrylate compound (B) containing no urethane bond, and a photopolymerization initiator (C),the compound (A) being a urethanized (meth)acrylic compound (A-1) having a polymer structure, and/or a urethanized (meth)acrylic compound (A-2) having no polymer structure,the compound (A-1) having a weight-average molecular weight of less than 1,000,the compound (A-2) having a molecular weight of less than 1,000,the compound (B) comprising at least one selected from the group consisting of a (meth)acrylate compound (b-I) represented by general formula (I), and a (meth)acrylate compound (b-II) represented by general formula (II). Descriptions of the symbols in the formulae are omitted.

IPC 8 full level

B33Y 10/00 (2015.01); A61C 7/08 (2006.01); A61C 13/01 (2006.01); A61F 5/56 (2006.01); A61K 6/62 (2020.01); A61K 6/887 (2020.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); C08F 222/10 (2006.01)

CPC (source: EP US)

A61C 7/08 (2013.01 - EP); A61C 13/01 (2013.01 - EP); A61F 5/566 (2013.01 - EP); A61K 6/62 (2020.01 - EP); A61K 6/887 (2020.01 - EP US); B33Y 10/00 (2014.12 - EP); B33Y 70/00 (2014.12 - EP US); B33Y 80/00 (2014.12 - EP); C08F 222/102 (2020.02 - EP); C08F 222/104 (2020.02 - EP); C08F 290/067 (2013.01 - US); C08G 18/3206 (2013.01 - US); C09D 4/00 (2013.01 - US); B33Y 80/00 (2014.12 - US); C08F 220/343 (2020.02 - EP)

C-Set (source: EP)

  1. A61K 6/887 + C08L 33/08
  2. A61K 6/887 + C08L 33/10
  3. C08F 222/102 + C08F 220/301
  4. C08F 222/104 + C08F 220/301 + C08F 220/306

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 4105250 A1 20221221; EP 4105250 A4 20240228; CN 115038730 A 20220909; CN 115038730 B 20241224; JP 7589219 B2 20241125; JP WO2021162007 A1 20210819; US 2023091071 A1 20230323; WO 2021162007 A1 20210819

DOCDB simple family (application)

EP 21754607 A 20210209; CN 202180013671 A 20210209; JP 2021004832 W 20210209; JP 2022500423 A 20210209; US 202117798358 A 20210209