Global Patent Index - EP 4106856 A1

EP 4106856 A1 20221228 - MOLD FOR PRODUCING MICROSTRUCTURES

Title (en)

MOLD FOR PRODUCING MICROSTRUCTURES

Title (de)

FORMELEMENT ZUR HERSTELLUNG VON MIKROSTRUKTUREN

Title (fr)

ÉLÉMENT DE MOULAGE POUR LA RÉALISATION DE MICROSTRUCTURES

Publication

EP 4106856 A1 20221228 (DE)

Application

EP 21705469 A 20210211

Priority

  • DE 102020104306 A 20200219
  • EP 2021053345 W 20210211

Abstract (en)

[origin: CA3168548A1] A mold, more particularly a casting mold for producing microstructures, more particularly microneedle arrays, has a main part (10). A plurality of recesses (14) are provided on a top face (12) of the main part (10) and are intended to receive material for producing the microstructure. In order to improve the quality of the microstructure to be produced, in particular during a drying process, channels (18) are provided on the top face (12) of the main part (10) and each channel is connected to at least one of the recesses (14).

IPC 8 full level

A61M 37/00 (2006.01); B29C 33/40 (2006.01); B29C 33/42 (2006.01); B29C 45/00 (2006.01); B81C 1/00 (2006.01); B81C 99/00 (2010.01)

CPC (source: EP US)

A61M 37/0015 (2013.01 - EP US); B29C 33/0061 (2013.01 - EP); B29C 33/0066 (2013.01 - EP US); B29C 33/405 (2013.01 - EP); B29C 33/42 (2013.01 - EP); B29C 39/02 (2013.01 - EP); B29C 39/24 (2013.01 - EP US); B29C 39/26 (2013.01 - EP US); A61M 2037/0053 (2013.01 - EP US); B29K 2883/00 (2013.01 - EP); B29L 2031/7544 (2013.01 - EP); B29L 2031/756 (2013.01 - EP)

Citation (search report)

See references of WO 2021165141A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

DE 102020104306 A1 20210819; BR 112022013734 A2 20221011; CA 3168548 A1 20210826; CN 115003364 A 20220902; EP 4106856 A1 20221228; JP 2023513966 A 20230404; US 2023347550 A1 20231102; WO 2021165141 A1 20210826

DOCDB simple family (application)

DE 102020104306 A 20200219; BR 112022013734 A 20210211; CA 3168548 A 20210211; CN 202180010116 A 20210211; EP 2021053345 W 20210211; EP 21705469 A 20210211; JP 2022549968 A 20210211; US 202117800679 A 20210211