Global Patent Index - EP 4110620 B1

EP 4110620 B1 20240619 - METHODS FOR MONITORING AT LEAST ONE ADHESIVE POINT USING A MONITORING SYSTEM AND MONITORING SYSTEMS FOR MONITORING AT LEAST ONE ADHESIVE POINT

Title (en)

METHODS FOR MONITORING AT LEAST ONE ADHESIVE POINT USING A MONITORING SYSTEM AND MONITORING SYSTEMS FOR MONITORING AT LEAST ONE ADHESIVE POINT

Title (de)

VERFAHREN ZUR KONTROLLE MINDESTENS EINER KLEBESTELLE MITTELS EINES KONTROLLSYSTEMS UND KONTROLLSYSTEME ZUR KONTROLLE MINDESTENS EINER KLEBESTELLE

Title (fr)

PROCÉDÉS DE SURVEILLANCE D'AU MOINS UN POINT D'ADHÉRENCE À L'AIDE D'UN SYSTÈME DE SURVEILLANCE ET SYSTÈMES DE SURVEILLANCE POUR SURVEILLER AU MOINS UN POINT D'ADHÉRENCE

Publication

EP 4110620 B1 20240619 (DE)

Application

EP 21734114 A 20210618

Priority

  • DE 102020120511 A 20200804
  • EP 2021052942 W 20210208
  • EP 2021066598 W 20210618

Abstract (en)

[origin: WO2022028762A1] The invention relates to a method for monitoring at least one adhesive point using a monitoring system, the at least one adhesive point being monitored by a monitoring process for at least one cylinder cover (629). The monitoring system has at least one monitoring device (631), wherein the at least one monitoring device (631) has at least one image capturing device, and the at least one monitoring device (631) monitors at least one free surface of the at least one cylinder cover (629). The at least one free surface is a region of the cylinder cover (629) which corresponds to the at least one adhesive point of at least one sheet (02), and the at least one monitoring device (631) detects the actual state of the at least one free surface of the at least one cylinder cover (629) before the cylinder cover is stretched onto at least one plate cylinder (616) of at least one application assembly (600) of a processing machine (01). The actual state of the at least one free surface is compared with a target state of the at least one free surface, and at least one signal is generated on the basis of the comparison. The invention also relates to an additional method for monitoring at least one adhesive point using a monitoring system and to monitoring systems for monitoring at least one adhesive point.

IPC 8 full level

B41F 33/02 (2006.01); B41F 13/004 (2006.01); B41F 19/00 (2006.01); B41F 21/12 (2006.01); B41F 33/00 (2006.01)

CPC (source: EP)

B41F 19/00 (2013.01); B41F 19/001 (2013.01); B41F 19/004 (2013.01); B41F 27/12 (2013.01); B41F 33/0036 (2013.01); B41F 33/02 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2022028762 A1 20220210; EP 4110620 A1 20230104; EP 4110620 B1 20240619

DOCDB simple family (application)

EP 2021066598 W 20210618; EP 21734114 A 20210618