EP 4119292 A1 20230118 - POLISHING COMPOSITION AND POLISHING METHOD
Title (en)
POLISHING COMPOSITION AND POLISHING METHOD
Title (de)
POLIERZUSAMMENSETZUNG UND POLIERVERFAHREN
Title (fr)
COMPOSITION DE POLISSAGE ET PROCÉDÉ DE POLISSAGE
Publication
Application
Priority
- JP 2020044716 A 20200313
- JP 2021007675 W 20210301
Abstract (en)
Provided is a polishing composition that can achieve wettability enhancement and haze reduction of a polished surface of a silicon wafer. The polishing composition for a silicon wafer contains an abrasive, a cellulose derivative, a surfactant, a basic compound, and water. Here, the cellulose derivative has a weight average molecular weight of more than 120 × 10<sup>4</sup>, and the surfactant has a molecular weight of less than 4000.
IPC 8 full level
B24B 37/00 (2012.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
C09G 1/02 (2013.01 - EP KR US); C09K 3/1409 (2013.01 - KR); C09K 3/1463 (2013.01 - EP); H01L 21/02024 (2013.01 - EP KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4119292 A1 20230118; EP 4119292 A4 20240207; CN 115244659 A 20221025; JP WO2021182155 A1 20210916; KR 20220150964 A 20221111; TW 202140739 A 20211101; US 2023143074 A1 20230511; WO 2021182155 A1 20210916
DOCDB simple family (application)
EP 21767349 A 20210301; CN 202180020155 A 20210301; JP 2021007675 W 20210301; JP 2022505929 A 20210301; KR 20227035055 A 20210301; TW 110108689 A 20210311; US 202117911087 A 20210301