Global Patent Index - EP 4120806 A1

EP 4120806 A1 20230118 - AN INTERCONNECT, AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

Title (en)

AN INTERCONNECT, AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

Title (de)

VERBINDUNG, ELEKTRONISCHE ANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN ANORDNUNG

Title (fr)

INTERCONNEXION, ENSEMBLE ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION D'UN ENSEMBLE ÉLECTRONIQUE

Publication

EP 4120806 A1 20230118 (EN)

Application

EP 21185696 A 20210715

Priority

EP 21185696 A 20210715

Abstract (en)

An interconnect (120; 220) for connecting a first electronic circuit (102; 202) to a second, external stretchable electronic circuit device (110) comprises: conductive lines (104; 204) of the first electronic circuit (102; 202) arranged in a plane; connectors (124; 224) configured to define an overlap in the plane between each end of the conductive lines (104; 204) with a corresponding end of stretchable conductive lines (112) providing an electrical connection between the conductive lines (104; 204) and the stretchable conductive lines (112) over the entire overlap; and at least one anchoring structure (130; 230) for providing an anchoring of the first electronic circuit (102; 202) with the second, external stretchable electronic circuit device (110), wherein the at least one anchoring structure (130; 230) provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.

IPC 8 full level

H05K 1/02 (2006.01); H05K 3/36 (2006.01); H05K 1/11 (2006.01)

CPC (source: EP US)

H01R 12/79 (2013.01 - US); H05K 1/0283 (2013.01 - EP US); H05K 1/0393 (2013.01 - US); H05K 1/147 (2013.01 - US); H05K 3/326 (2013.01 - US); H05K 3/361 (2013.01 - EP); H05K 1/118 (2013.01 - EP); H05K 2201/0129 (2013.01 - US); H05K 2201/0133 (2013.01 - EP); H05K 2201/052 (2013.01 - EP); H05K 2201/09063 (2013.01 - EP); H05K 2201/10189 (2013.01 - EP); H05K 2203/128 (2013.01 - EP); H05K 2203/1316 (2013.01 - EP); H05K 2203/1327 (2013.01 - EP)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4120806 A1 20230118; US 11856692 B2 20231226; US 2023012885 A1 20230119

DOCDB simple family (application)

EP 21185696 A 20210715; US 202217864707 A 20220714