EP 4122624 A1 20230125 - BONDING SHEET AND BONDED STRUCTURE
Title (en)
BONDING SHEET AND BONDED STRUCTURE
Title (de)
VERBINDUNGSFOLIE UND VERBUNDENE STRUKTUR
Title (fr)
FEUILLE D'ASSEMBLAGE ET STRUCTURE ASSEMBLÉE
Publication
Application
Priority
- JP 2020050001 A 20200319
- JP 2021010065 W 20210312
Abstract (en)
A bonding sheet (1) according to the present invention includes a copper foil (2) and sinterable bonding films (3) formed on both faces of the copper foil (2). The bonding films (3) each contain copper particles and a solid reducing agent. The bonding sheet (1) is used to bond to a target object to be bonded (5) having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. The present invention also provides a bonded structure (10) including; a bonded object (5) having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil (2); and a bonding layer (30) including a sintered structure of copper particles; and the bonded object (5) and the copper foil (2) are electrically connected to each other via the bonding layer (30).
IPC 8 full level
B22F 7/08 (2006.01); C09J 1/00 (2006.01); C09J 7/28 (2006.01); C09J 9/02 (2006.01)
CPC (source: EP KR US)
B22F 1/052 (2022.01 - EP); B22F 1/103 (2022.01 - EP); B22F 1/107 (2022.01 - EP); B22F 7/04 (2013.01 - EP); B22F 7/08 (2013.01 - EP KR); B23K 35/007 (2013.01 - EP); B23K 35/0233 (2013.01 - EP); B23K 35/0238 (2013.01 - EP); B32B 9/005 (2013.01 - EP); B32B 9/041 (2013.01 - EP); B32B 15/01 (2013.01 - EP); B32B 15/018 (2013.01 - EP US); B32B 15/20 (2013.01 - EP); C09J 1/00 (2013.01 - EP KR US); C09J 7/28 (2018.01 - KR US); C09J 9/02 (2013.01 - KR); H01L 24/00 (2013.01 - EP); H01L 24/26 (2013.01 - EP); H01L 24/29 (2013.01 - US); H01L 24/83 (2013.01 - EP US); B22F 7/08 (2013.01 - US); B22F 2007/042 (2013.01 - EP); B22F 2998/10 (2013.01 - EP); B22F 2999/00 (2013.01 - EP); B32B 2255/06 (2013.01 - EP); B32B 2255/205 (2013.01 - EP); B32B 2307/202 (2013.01 - EP); B32B 2307/302 (2013.01 - EP); B32B 2457/14 (2013.01 - EP); C08K 2003/085 (2013.01 - EP); C09J 2203/326 (2013.01 - EP US); C09J 2301/124 (2020.08 - EP); C09J 2400/16 (2013.01 - EP); C09J 2400/163 (2013.01 - EP US); C09J 2400/166 (2013.01 - EP); H01L 23/3735 (2013.01 - US); H01L 23/3736 (2013.01 - US); H01L 2224/29083 (2013.01 - US); H01L 2224/29147 (2013.01 - US); H01L 2224/29293 (2013.01 - US); H01L 2224/29347 (2013.01 - US); H01L 2224/83439 (2013.01 - US); H01L 2224/83444 (2013.01 - US); H01L 2224/83447 (2013.01 - US); H01L 2224/83455 (2013.01 - US)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4122624 A1 20230125; EP 4122624 A4 20230830; CN 115103730 A 20220923; JP WO2021187362 A1 20210923; KR 20220152384 A 20221115; TW 202208567 A 20220301; US 2023005871 A1 20230105; WO 2021187362 A1 20210923
DOCDB simple family (application)
EP 21771632 A 20210312; CN 202180014769 A 20210312; JP 2021010065 W 20210312; JP 2022508313 A 20210312; KR 20227025398 A 20210312; TW 110109325 A 20210316; US 202117793161 A 20210312