EP 4126496 A1 20230208 - DEVICE AND METHOD FOR INJECTION MOLDING
Title (en)
DEVICE AND METHOD FOR INJECTION MOLDING
Title (de)
VORRICHTUNG UND VERFAHREN ZUM SPRITZGIESSEN
Title (fr)
DISPOSITIF ET PROCÉDÉ DE MOULAGE PAR INJECTION
Publication
Application
Priority
EP 2020059281 W 20200401
Abstract (en)
[origin: WO2021197599A1] The invention particularly relates to a device for injection molding, in particularly micro-injection molding, at least comprising a mold having a first mold half and a second mold half, the first mold half and the second mold half defining an injection molding chamber in the closed state of the mold, the device also comprising an insert in the injection molding chamber.
IPC 8 full level
B29C 45/33 (2006.01); B29C 33/00 (2006.01); B29C 45/00 (2006.01); B29C 45/26 (2006.01); B29C 45/37 (2006.01); B29C 45/80 (2006.01); B29L 31/00 (2006.01)
CPC (source: EP KR US)
B29C 45/14 (2013.01 - US); B29C 45/26 (2013.01 - US); B29C 45/2606 (2013.01 - EP KR); B29C 45/2632 (2013.01 - EP KR); B29C 45/2675 (2013.01 - EP); B29C 45/372 (2013.01 - EP KR); B29C 45/376 (2013.01 - EP KR); B29C 45/768 (2013.01 - US); B29C 45/80 (2013.01 - EP KR); B29C 2033/0005 (2013.01 - EP KR); B29C 2045/0094 (2013.01 - EP KR); B29C 2045/2653 (2013.01 - EP KR); B29C 2945/76163 (2013.01 - US); B29C 2945/76294 (2013.01 - US); B29C 2945/76357 (2013.01 - US); B29C 2945/76568 (2013.01 - US); B29C 2945/76772 (2013.01 - US); B29C 2945/76836 (2013.01 - US); B29K 2821/006 (2013.01 - EP KR); B29K 2883/00 (2013.01 - EP KR); B29L 2031/34 (2013.01 - KR); B29L 2031/756 (2013.01 - EP)
Citation (search report)
See references of WO 2021197599A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2021197599 A1 20211007; CN 115279571 A 20221101; EP 4126496 A1 20230208; JP 2023532167 A 20230727; KR 20220163368 A 20221209; TW 202204125 A 20220201; US 2023150180 A1 20230518
DOCDB simple family (application)
EP 2020059281 W 20200401; CN 202080099110 A 20200401; EP 20717142 A 20200401; JP 2022558327 A 20200401; KR 20227032255 A 20200401; TW 110109675 A 20210318; US 202017910660 A 20200401