Title (en)

OPTIMIZED PROCESS FOR GRAPHIC PERSONALIZATION OF CHIP-CARD MODULES AND OBTAINED MODULE

Title (de)

OPTIMIERTES VERFAHREN ZUR GRAPHISCHEN PERSONALISIERUNG VON CHIPKARTENMODULEN UND ERHALTENES MODUL

Title (fr)

PROCÉDÉ DE PERSONNALISATION GRAPHIQUE OPTIMISÉ DE MODULES DE CARTE À PUCE ET MODULE OBTENU

Publication

EP 4128048 A1 20230208 (FR)

Application

EP 21711887 A 20210317

Priority

• EP 20315082 A 20200331
• EP 2021056758 W 20210317

Abstract (en)

[origin: WO2021197843A1] The invention relates to a process for manufacturing a standard chip-card module (1) comprising metallized contacts (P1-P6) defining a graphic design comprising visible parts formed from lines, segments or dots, a first portion (2A, 12A) of which passes right through the thickness of the metallized contacts (P1-P6) and a second portion (2B, 12B) of which is formed only superficially on the upper external surface of the metallized contacts (P1-P6), characterized in that said second portion (2A, 12A) is produced in the continuity of the first portion, to form said graphic design. The invention also relates to the obtained module.

IPC 8 full level

G06K 19/077 (2006.01)

CPC (source: EP KR US)

G06K 1/12 (2013.01 - US); G06K 19/07716 (2013.01 - US); G06K 19/07743 (2013.01 - EP KR); G06K 19/07747 (2013.01 - EP KR)

Citation (search report)

See references of WO 2021197843A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 3889839 A1 20211006; CN 115605874 A 20230113; EP 4128048 A1 20230208; KR 20220162766 A 20221208; US 11915082 B2 20240227; US 2023161991 A1 20230525; WO 2021197843 A1 20211007

DOCDB simple family (application)

EP 20315082 A 20200331; CN 202180038903 A 20210317; EP 2021056758 W 20210317; EP 21711887 A 20210317; KR 20227038022 A 20210317; US 202117912894 A 20210317