EP 4128326 A2 20230208 - METHOD FOR CONTACTING A POWER SEMICONDUCTOR WITH A SUBSTRATE, AND POWER SEMICONDUCTOR MODULE HAVING A POWER SEMICONDUCTOR AND A SUBSTRATE
Title (en)
METHOD FOR CONTACTING A POWER SEMICONDUCTOR WITH A SUBSTRATE, AND POWER SEMICONDUCTOR MODULE HAVING A POWER SEMICONDUCTOR AND A SUBSTRATE
Title (de)
VERFAHREN ZUR KONTAKTIERUNG EINES LEISTUNGSHALBLEITERS AUF EINEM SUBSTRAT SOWIE LEISTUNGSHALBLEITERMODUL MIT EINEM LEISTUNGSHALBLEITER UND EINEM SUBSTRAT
Title (fr)
PROCÉDÉ DE MISE EN CONTACT D'UN SEMI-CONDUCTEUR DE PUISSANCE SUR UN SUBSTRAT
Publication
Application
Priority
- EP 20181634 A 20200623
- EP 2021061372 W 20210430
Abstract (en)
[origin: WO2021259536A2] The invention relates to a method for contacting a power semiconductor device (2) on a substrate (4). In order to achieve improved switching behaviour and a higher maximum current density, according to the invention the power semiconductor device (2) has, on a side (8) facing the substrate (4), at least two contact regions (10, 12) which are electrically isolated from one another, and the at least two contact regions (10, 12) of the power semiconductor device (2) which are electrically isolated from from one another are integrally bonded to the substrate (4) by means of a structured, in particular metal, connecting layer (26) which comprises at least two substantially closed sintered layers (20, 24, 36).
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/485 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01)
CPC (source: EP US)
H01L 21/4867 (2013.01 - EP); H01L 23/49811 (2013.01 - EP); H01L 23/49833 (2013.01 - EP); H01L 24/11 (2013.01 - EP); H01L 24/13 (2013.01 - EP); H01L 24/14 (2013.01 - EP); H01L 24/27 (2013.01 - EP); H01L 24/29 (2013.01 - EP); H01L 24/30 (2013.01 - EP); H01L 24/73 (2013.01 - EP US); H01L 24/81 (2013.01 - EP); H01L 24/83 (2013.01 - EP US); H01L 24/16 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/33 (2013.01 - EP); H01L 2224/0603 (2013.01 - EP); H01L 2224/11003 (2013.01 - EP); H01L 2224/111 (2013.01 - EP); H01L 2224/1132 (2013.01 - EP); H01L 2224/11332 (2013.01 - EP); H01L 2224/11334 (2013.01 - EP); H01L 2224/11848 (2013.01 - EP); H01L 2224/119 (2013.01 - EP); H01L 2224/11901 (2013.01 - EP); H01L 2224/11903 (2013.01 - EP); H01L 2224/13082 (2013.01 - EP); H01L 2224/13083 (2013.01 - EP); H01L 2224/13124 (2013.01 - EP); H01L 2224/13139 (2013.01 - EP); H01L 2224/13144 (2013.01 - EP); H01L 2224/13147 (2013.01 - EP); H01L 2224/13157 (2013.01 - EP); H01L 2224/13169 (2013.01 - EP); H01L 2224/1318 (2013.01 - EP); H01L 2224/13294 (2013.01 - EP); H01L 2224/13339 (2013.01 - EP); H01L 2224/141 (2013.01 - EP); H01L 2224/1412 (2013.01 - EP); H01L 2224/16227 (2013.01 - EP); H01L 2224/27003 (2013.01 - EP); H01L 2224/271 (2013.01 - EP); H01L 2224/2732 (2013.01 - EP); H01L 2224/27332 (2013.01 - EP); H01L 2224/27334 (2013.01 - EP); H01L 2224/27848 (2013.01 - EP); H01L 2224/279 (2013.01 - EP); H01L 2224/27901 (2013.01 - EP); H01L 2224/27903 (2013.01 - EP); H01L 2224/29082 (2013.01 - EP); H01L 2224/29083 (2013.01 - EP); H01L 2224/29124 (2013.01 - EP); H01L 2224/29139 (2013.01 - EP); H01L 2224/29144 (2013.01 - EP); H01L 2224/29147 (2013.01 - EP); H01L 2224/29157 (2013.01 - EP); H01L 2224/29169 (2013.01 - EP); H01L 2224/2918 (2013.01 - EP); H01L 2224/29294 (2013.01 - EP); H01L 2224/29339 (2013.01 - EP); H01L 2224/3003 (2013.01 - EP); H01L 2224/30051 (2013.01 - EP); H01L 2224/301 (2013.01 - EP); H01L 2224/3012 (2013.01 - EP); H01L 2224/3016 (2013.01 - EP); H01L 2224/32227 (2013.01 - EP); H01L 2224/33181 (2013.01 - EP); H01L 2224/73203 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP US); H01L 2224/8184 (2013.01 - EP); H01L 2224/83192 (2013.01 - EP); H01L 2224/83203 (2013.01 - US); H01L 2224/8384 (2013.01 - EP US); H01L 2924/13055 (2013.01 - US); H01L 2924/30107 (2013.01 - US)
C-Set (source: EP)
- H01L 2224/2732 + H01L 2924/00012
- H01L 2224/27848 + H01L 2924/00012
- H01L 2224/29147 + H01L 2924/00014
- H01L 2224/29139 + H01L 2924/00014
- H01L 2224/29144 + H01L 2924/00014
- H01L 2224/29124 + H01L 2924/00014
- H01L 2224/29157 + H01L 2924/00014
- H01L 2224/29169 + H01L 2924/00014
- H01L 2224/2918 + H01L 2924/00014
- H01L 2224/29339 + H01L 2924/00014
- H01L 2224/3012 + H01L 2924/00012
- H01L 2224/301 + H01L 2924/00012
- H01L 2224/271 + H01L 2924/00012
- H01L 2224/27901 + H01L 2224/2732
- H01L 2224/279 + H01L 2224/2732 + H01L 2224/27334
- H01L 2224/27901 + H01L 2224/27334
- H01L 2224/27901 + H01L 2224/2732 + H01L 2224/27848
- H01L 2224/279 + H01L 2224/2732 + H01L 2224/27848 + H01L 2224/2732 + H01L 2224/27848
- H01L 2224/279 + H01L 2224/2732 + H01L 2224/27848 + H01L 2224/27334
- H01L 2224/111 + H01L 2924/00012
- H01L 2224/1132 + H01L 2924/00012
- H01L 2224/11848 + H01L 2924/00012
- H01L 2224/119 + H01L 2224/1132 + H01L 2224/11334
- H01L 2224/119 + H01L 2224/1132 + H01L 2224/11848 + H01L 2224/11334 + H01L 2224/11848
- H01L 2224/119 + H01L 2224/1132 + H01L 2224/11848 + H01L 2224/11334
- H01L 2224/11901 + H01L 2224/1132 + H01L 2224/11848
- H01L 2224/11901 + H01L 2224/1132
- H01L 2224/11901 + H01L 2224/11334
- H01L 2224/13124 + H01L 2924/00014
- H01L 2224/13139 + H01L 2924/00014
- H01L 2224/13144 + H01L 2924/00014
- H01L 2224/13147 + H01L 2924/00014
- H01L 2224/13157 + H01L 2924/00014
- H01L 2224/13169 + H01L 2924/00014
- H01L 2224/1318 + H01L 2924/00014
- H01L 2224/13339 + H01L 2924/00014
- H01L 2224/141 + H01L 2924/00012
- H01L 2224/1412 + H01L 2924/00012
- H01L 2224/73203 + H01L 2924/00012
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2021259536 A2 20211230; WO 2021259536 A3 20220707; CN 115917719 A 20230404; EP 4128326 A2 20230208; US 2023343745 A1 20231026
DOCDB simple family (application)
EP 2021061372 W 20210430; CN 202180044569 A 20210430; EP 21725421 A 20210430; US 202118012554 A 20210430