Global Patent Index - EP 4128326 A2

EP 4128326 A2 20230208 - METHOD FOR CONTACTING A POWER SEMICONDUCTOR WITH A SUBSTRATE, AND POWER SEMICONDUCTOR MODULE HAVING A POWER SEMICONDUCTOR AND A SUBSTRATE

Title (en)

METHOD FOR CONTACTING A POWER SEMICONDUCTOR WITH A SUBSTRATE, AND POWER SEMICONDUCTOR MODULE HAVING A POWER SEMICONDUCTOR AND A SUBSTRATE

Title (de)

VERFAHREN ZUR KONTAKTIERUNG EINES LEISTUNGSHALBLEITERS AUF EINEM SUBSTRAT SOWIE LEISTUNGSHALBLEITERMODUL MIT EINEM LEISTUNGSHALBLEITER UND EINEM SUBSTRAT

Title (fr)

PROCÉDÉ DE MISE EN CONTACT D'UN SEMI-CONDUCTEUR DE PUISSANCE SUR UN SUBSTRAT

Publication

EP 4128326 A2 20230208 (DE)

Application

EP 21725421 A 20210430

Priority

  • EP 20181634 A 20200623
  • EP 2021061372 W 20210430

Abstract (en)

[origin: WO2021259536A2] The invention relates to a method for contacting a power semiconductor device (2) on a substrate (4). In order to achieve improved switching behaviour and a higher maximum current density, according to the invention the power semiconductor device (2) has, on a side (8) facing the substrate (4), at least two contact regions (10, 12) which are electrically isolated from one another, and the at least two contact regions (10, 12) of the power semiconductor device (2) which are electrically isolated from from one another are integrally bonded to the substrate (4) by means of a structured, in particular metal, connecting layer (26) which comprises at least two substantially closed sintered layers (20, 24, 36).

IPC 8 full level

H01L 21/60 (2006.01); H01L 23/485 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01)

CPC (source: EP US)

H01L 21/4867 (2013.01 - EP); H01L 23/49811 (2013.01 - EP); H01L 23/49833 (2013.01 - EP); H01L 24/11 (2013.01 - EP); H01L 24/13 (2013.01 - EP); H01L 24/14 (2013.01 - EP); H01L 24/27 (2013.01 - EP); H01L 24/29 (2013.01 - EP); H01L 24/30 (2013.01 - EP); H01L 24/73 (2013.01 - EP US); H01L 24/81 (2013.01 - EP); H01L 24/83 (2013.01 - EP US); H01L 24/16 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/33 (2013.01 - EP); H01L 2224/0603 (2013.01 - EP); H01L 2224/11003 (2013.01 - EP); H01L 2224/111 (2013.01 - EP); H01L 2224/1132 (2013.01 - EP); H01L 2224/11332 (2013.01 - EP); H01L 2224/11334 (2013.01 - EP); H01L 2224/11848 (2013.01 - EP); H01L 2224/119 (2013.01 - EP); H01L 2224/11901 (2013.01 - EP); H01L 2224/11903 (2013.01 - EP); H01L 2224/13082 (2013.01 - EP); H01L 2224/13083 (2013.01 - EP); H01L 2224/13124 (2013.01 - EP); H01L 2224/13139 (2013.01 - EP); H01L 2224/13144 (2013.01 - EP); H01L 2224/13147 (2013.01 - EP); H01L 2224/13157 (2013.01 - EP); H01L 2224/13169 (2013.01 - EP); H01L 2224/1318 (2013.01 - EP); H01L 2224/13294 (2013.01 - EP); H01L 2224/13339 (2013.01 - EP); H01L 2224/141 (2013.01 - EP); H01L 2224/1412 (2013.01 - EP); H01L 2224/16227 (2013.01 - EP); H01L 2224/27003 (2013.01 - EP); H01L 2224/271 (2013.01 - EP); H01L 2224/2732 (2013.01 - EP); H01L 2224/27332 (2013.01 - EP); H01L 2224/27334 (2013.01 - EP); H01L 2224/27848 (2013.01 - EP); H01L 2224/279 (2013.01 - EP); H01L 2224/27901 (2013.01 - EP); H01L 2224/27903 (2013.01 - EP); H01L 2224/29082 (2013.01 - EP); H01L 2224/29083 (2013.01 - EP); H01L 2224/29124 (2013.01 - EP); H01L 2224/29139 (2013.01 - EP); H01L 2224/29144 (2013.01 - EP); H01L 2224/29147 (2013.01 - EP); H01L 2224/29157 (2013.01 - EP); H01L 2224/29169 (2013.01 - EP); H01L 2224/2918 (2013.01 - EP); H01L 2224/29294 (2013.01 - EP); H01L 2224/29339 (2013.01 - EP); H01L 2224/3003 (2013.01 - EP); H01L 2224/30051 (2013.01 - EP); H01L 2224/301 (2013.01 - EP); H01L 2224/3012 (2013.01 - EP); H01L 2224/3016 (2013.01 - EP); H01L 2224/32227 (2013.01 - EP); H01L 2224/33181 (2013.01 - EP); H01L 2224/73203 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP US); H01L 2224/8184 (2013.01 - EP); H01L 2224/83192 (2013.01 - EP); H01L 2224/83203 (2013.01 - US); H01L 2224/8384 (2013.01 - EP US); H01L 2924/13055 (2013.01 - US); H01L 2924/30107 (2013.01 - US)

C-Set (source: EP)

  1. H01L 2224/2732 + H01L 2924/00012
  2. H01L 2224/27848 + H01L 2924/00012
  3. H01L 2224/29147 + H01L 2924/00014
  4. H01L 2224/29139 + H01L 2924/00014
  5. H01L 2224/29144 + H01L 2924/00014
  6. H01L 2224/29124 + H01L 2924/00014
  7. H01L 2224/29157 + H01L 2924/00014
  8. H01L 2224/29169 + H01L 2924/00014
  9. H01L 2224/2918 + H01L 2924/00014
  10. H01L 2224/29339 + H01L 2924/00014
  11. H01L 2224/3012 + H01L 2924/00012
  12. H01L 2224/301 + H01L 2924/00012
  13. H01L 2224/271 + H01L 2924/00012
  14. H01L 2224/27901 + H01L 2224/2732
  15. H01L 2224/279 + H01L 2224/2732 + H01L 2224/27334
  16. H01L 2224/27901 + H01L 2224/27334
  17. H01L 2224/27901 + H01L 2224/2732 + H01L 2224/27848
  18. H01L 2224/279 + H01L 2224/2732 + H01L 2224/27848 + H01L 2224/2732 + H01L 2224/27848
  19. H01L 2224/279 + H01L 2224/2732 + H01L 2224/27848 + H01L 2224/27334
  20. H01L 2224/111 + H01L 2924/00012
  21. H01L 2224/1132 + H01L 2924/00012
  22. H01L 2224/11848 + H01L 2924/00012
  23. H01L 2224/119 + H01L 2224/1132 + H01L 2224/11334
  24. H01L 2224/119 + H01L 2224/1132 + H01L 2224/11848 + H01L 2224/11334 + H01L 2224/11848
  25. H01L 2224/119 + H01L 2224/1132 + H01L 2224/11848 + H01L 2224/11334
  26. H01L 2224/11901 + H01L 2224/1132 + H01L 2224/11848
  27. H01L 2224/11901 + H01L 2224/1132
  28. H01L 2224/11901 + H01L 2224/11334
  29. H01L 2224/13124 + H01L 2924/00014
  30. H01L 2224/13139 + H01L 2924/00014
  31. H01L 2224/13144 + H01L 2924/00014
  32. H01L 2224/13147 + H01L 2924/00014
  33. H01L 2224/13157 + H01L 2924/00014
  34. H01L 2224/13169 + H01L 2924/00014
  35. H01L 2224/1318 + H01L 2924/00014
  36. H01L 2224/13339 + H01L 2924/00014
  37. H01L 2224/141 + H01L 2924/00012
  38. H01L 2224/1412 + H01L 2924/00012
  39. H01L 2224/73203 + H01L 2924/00012

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2021259536 A2 20211230; WO 2021259536 A3 20220707; CN 115917719 A 20230404; EP 4128326 A2 20230208; US 2023343745 A1 20231026

DOCDB simple family (application)

EP 2021061372 W 20210430; CN 202180044569 A 20210430; EP 21725421 A 20210430; US 202118012554 A 20210430