Global Patent Index - EP 4130094 A4

EP 4130094 A4 20240417 - CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED PRODUCT

Title (en)

CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED PRODUCT

Title (de)

HÄRTUNGSKATALYSATOR, HARZZUSAMMENSETZUNG, DICHTUNGSMATERIAL, KLEBSTOFF UND GEHÄRTETES PRODUKT

Title (fr)

CATALYSEUR DE DURCISSEMENT, COMPOSITION DE RÉSINE, MATÉRIAU D'ÉTANCHÉITÉ, ADHÉSIF ET PRODUIT DURCI

Publication

EP 4130094 A4 20240417 (EN)

Application

EP 20929256 A 20200424

Priority

  • JP 2020064472 A 20200331
  • JP 2020017853 W 20200424

Abstract (en)

[origin: EP4130094A1] An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R<sup>1</sup> is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R<sup>2</sup> and R<sup>3</sup> are each independently a group selected from hydrogen and C1-C6 alkyls.)

IPC 8 full level

C08G 59/68 (2006.01); C08G 59/18 (2006.01); C08G 59/40 (2006.01); C09J 163/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)

CPC (source: EP KR US)

C08G 59/184 (2013.01 - EP); C08G 59/4014 (2013.01 - US); C08G 59/42 (2013.01 - KR); C08G 59/4215 (2013.01 - EP); C08G 59/44 (2013.01 - KR); C08G 59/621 (2013.01 - KR); C08G 59/686 (2013.01 - EP KR); C08L 63/00 (2013.01 - US); C09J 163/00 (2013.01 - EP KR US); H01L 23/293 (2013.01 - KR); H01L 23/295 (2013.01 - EP)

Citation (search report)

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 4130094 A1 20230208; EP 4130094 A4 20240417; CN 115003727 A 20220902; CN 115003727 B 20240402; JP 7316009 B2 20230727; JP WO2021199450 A1 20211007; KR 20220155260 A 20221122; TW 202138355 A 20211016; US 2023097646 A1 20230330; WO 2021199450 A1 20211007

DOCDB simple family (application)

EP 20929256 A 20200424; CN 202080094013 A 20200424; JP 2020017853 W 20200424; JP 2022511497 A 20200424; KR 20227025663 A 20200424; TW 110110408 A 20210323; US 202017802784 A 20200424