EP 4134197 A1 20230215 - PHASE MODIFIED QUASI-NON-DIFFRACTING LASER BEAMS FOR SIMULTANEOUS HIGH ANGLE LASER PROCESSING OF TRANSPARENT WORKPIECES
Title (en)
PHASE MODIFIED QUASI-NON-DIFFRACTING LASER BEAMS FOR SIMULTANEOUS HIGH ANGLE LASER PROCESSING OF TRANSPARENT WORKPIECES
Title (de)
PHASENMODIFIZIERTE QUASI-NICHT-DIFFRAKTIONSLASERSTRAHLEN FÜR DIE SIMULTANE HOCHWINKEL-LASERVERARBEITUNG VON TRANSPARENTEN WERKSTÜCKEN
Title (fr)
FAISCEAUX LASER QUASI-NON-DIFFRACTANTS À PHASE MODIFIÉE POUR LE TRAITEMENT LASER SIMULTANÉ À ANGLE ÉLEVÉ DE PIÈCES TRANSPARENTES
Publication
Application
Priority
- US 202163226369 P 20210728
- NL 2029054 A 20210825
Abstract (en)
A method of processing a transparent workpiece that includes directing a laser beam combination comprising a first beam and a second beam into the transparent workpiece simultaneously, the first beam passing through an impingement surface of the transparent workpiece at a first impingement location and the second beam passing through the impingement surface at a second impingement location. The first beam forms a first laser beam focal line in the transparent workpiece and generates a first induced absorption to produce a first defect segment within the transparent workpiece, the first defect segment having a first chamfer angle and the second beam forms a second laser beam focal line in the transparent workpiece and generates a second induced absorption to produce a second defect segment within the transparent workpiece, the second defect segment having a second chamfer angle, the second chamfer angle differing from the first chamfer angle.
IPC 8 full level
B23K 26/067 (2006.01); B23K 26/06 (2006.01); B23K 26/53 (2014.01); B23K 103/00 (2006.01)
CPC (source: EP US)
B23K 26/0604 (2013.01 - EP US); B23K 26/0608 (2013.01 - EP); B23K 26/0652 (2013.01 - EP); B23K 26/066 (2015.10 - US); B23K 26/067 (2013.01 - US); B23K 26/0676 (2013.01 - EP); B23K 26/073 (2013.01 - US); B23K 26/38 (2013.01 - EP); B23K 26/55 (2015.10 - US); G02B 5/1819 (2013.01 - EP); G02B 26/06 (2013.01 - EP); B23K 26/0643 (2013.01 - US); B23K 26/0648 (2013.01 - US); B23K 2103/54 (2018.08 - EP); G02B 5/001 (2013.01 - EP)
Citation (applicant)
US 10730783 B2 20200804 - AKARAPU RAVINDRA KUMAR [US], et al
Citation (search report)
- [X] US 2015034613 A1 20150205 - HOSSEINI S ABBAS [US]
- [I] US 2020361037 A1 20201119 - IVANOV VIACHESLAV VIACHESLAVOVICH [RU], et al
- [AP] WO 2021158458 A1 20210812 - CORNING INC [US]
- [A] US 2011141567 A1 20110616 - STACK JARED [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4134197 A1 20230215; US 2023036386 A1 20230202; WO 2023009331 A1 20230202
DOCDB simple family (application)
EP 22186741 A 20220725; US 2022037272 W 20220715; US 202217872375 A 20220725