EP 4139622 A1 20230301 - HEAT PIPE FOR ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THEREFOR
Title (en)
HEAT PIPE FOR ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THEREFOR
Title (de)
WÄRMEROHR FÜR ELEKTRONISCHE VORRICHTUNG UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
CALODUC POUR UN DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
BY 2020000004 W 20200518
Abstract (en)
[origin: WO2021232134A1] Disclosed is a heat pipe (100) for an electronic device. The heat pipe (100) comprises a body (102) having a generally planar, metallic structure. The body comprises a first module (102A) and a second module (102B) joined together to define an internal volume. Each of the first module (102A) and the second module (102B) has a foldable portion (106) therein. The heat pipe further comprises a polymeric layer (104) disposed over the foldable portion (106) of each of the first module (102A) and the second module (102B), of the body (102).
IPC 8 full level
F28D 15/02 (2006.01)
CPC (source: EP)
F28D 15/0241 (2013.01)
Citation (search report)
See references of WO 2021232134A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DOCDB simple family (application)
BY 2020000004 W 20200518; EP 20742636 A 20200518