Global Patent Index - EP 4143263 A1

EP 4143263 A1 20230308 - COMPOSITION FOR MATTING AND REDUCING ANTI-FINGERPRINT EFFECTS ON SURFACES OF SUBSTRATE MATERIALS

Title (en)

COMPOSITION FOR MATTING AND REDUCING ANTI-FINGERPRINT EFFECTS ON SURFACES OF SUBSTRATE MATERIALS

Title (de)

ZUSAMMENSETZUNG ZUR MATTIERUNG UND REDUZIERUNG VON ANTI-FINGERPRINT-EFFEKTEN VON OBERFLÄCHEN AUF TRÄGERMATERIALIEN

Title (fr)

COMPOSITION POUR LE MATAGE ET LA RÉDUCTION DES EFFETS ANTI-EMPREINTES DE SURFACES SUR DES MATÉRIAUX SUPPORT

Publication

EP 4143263 A1 20230308 (DE)

Application

EP 21725967 A 20210427

Priority

  • EP 20172323 A 20200430
  • EP 2021060988 W 20210427

Abstract (en)

[origin: WO2021219640A1] The invention relates to a resin suspension based on a formaldehyde resin comprising a composition for matting and reducing anti-fingerprint effects on surfaces of substrate materials, in particular paper layers and wood boards, wherein the composition has silane compounds and at least one matting agent. The invention additionally relates to a method for producing same, to the use of said composition, and to substrate materials, such as paper layers or wood boards, comprising said composition.

IPC 8 full level

C09D 5/00 (2006.01); C09D 5/06 (2006.01); C09D 7/00 (2006.01)

CPC (source: EP US)

C09D 5/00 (2013.01 - EP US); C09D 5/006 (2013.01 - EP); C09D 7/00 (2013.01 - EP); C09D 7/42 (2017.12 - US); C09D 7/62 (2017.12 - US); C09D 7/65 (2017.12 - US); C09D 161/28 (2013.01 - US); D21H 19/40 (2013.01 - US); D21H 19/62 (2013.01 - US); D21H 21/16 (2013.01 - US); C08L 61/28 (2013.01 - EP)

Citation (search report)

See references of WO 2021219640A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 3904463 A1 20211103; CN 115485339 A 20221216; CN 115485339 B 20231128; EP 4143263 A1 20230308; US 2023174791 A1 20230608; WO 2021219640 A1 20211104

DOCDB simple family (application)

EP 20172323 A 20200430; CN 202180032109 A 20210427; EP 2021060988 W 20210427; EP 21725967 A 20210427; US 202117922297 A 20210427