EP 4144881 A1 20230308 - ALLOY MATERIAL AND METHOD FOR PRODUCING SAME
Title (en)
ALLOY MATERIAL AND METHOD FOR PRODUCING SAME
Title (de)
LEGIERUNGSMATERIAL UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
MATÉRIAU D'ALLIAGE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- JP 2020079036 A 20200428
- JP 2021016573 W 20210426
Abstract (en)
An alloy material is provided which contains elements including, in mass%, C: 0.010 to 0.10%, Si: more than 0.10% to 0.50% or less, Mn: 0.05 to 0.50%, Ni: 34.5 to 37.0%, and Nb: 0.001 to 1.0%, and which satisfies [T<sub>0</sub> ≤ Ti-2], [C-Nb/7.7-Ta/15 ≤ 0.045], [Nb-7.7C ≤ 0.30], and [Ta-15C ≤ 0.30]. Where, each symbol of an element in the above formulas represents a content (mass%) of the corresponding element, T<sub>0</sub> represents a Curie temperature (°C) of the alloy material, and T<sub>1</sub> represents a Curie temperature (°C) of the alloy material after the alloy material is held at 900°C for one minute and thereafter is cooled under conditions such that an average cooling rate in a temperature range from 600 to 300°C is 0.2°C/s.
IPC 8 full level
C22C 38/00 (2006.01); B21B 1/38 (2006.01); C21D 6/00 (2006.01); C21D 8/02 (2006.01); C22C 38/60 (2006.01)
CPC (source: EP US)
C21D 1/02 (2013.01 - EP); C21D 1/26 (2013.01 - EP); C21D 1/60 (2013.01 - EP); C21D 6/004 (2013.01 - US); C21D 8/0205 (2013.01 - EP US); C21D 8/0242 (2013.01 - EP); C21D 8/0247 (2013.01 - EP); C21D 9/46 (2013.01 - EP); C22C 38/002 (2013.01 - EP); C22C 38/005 (2013.01 - EP); C22C 38/02 (2013.01 - EP); C22C 38/04 (2013.01 - EP); C22C 38/42 (2013.01 - EP); C22C 38/44 (2013.01 - EP); C22C 38/46 (2013.01 - EP); C22C 38/48 (2013.01 - EP); C22C 38/52 (2013.01 - EP); C22C 38/54 (2013.01 - EP); C22C 38/60 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4144881 A1 20230308; EP 4144881 A4 20231115; JP 7460761 B2 20240402; JP WO2021221003 A1 20211104; US 2023143965 A1 20230511; WO 2021221003 A1 20211104
DOCDB simple family (application)
EP 21796033 A 20210426; JP 2021016573 W 20210426; JP 2022518048 A 20210426; US 202117918337 A 20210426