EP 4149711 A1 20230322 - LASER-CUTTING METHOD AND LASER-CUTTING INSTALLATION
Title (en)
LASER-CUTTING METHOD AND LASER-CUTTING INSTALLATION
Title (de)
LASERSCHNEIDVERFAHREN UND LASERSCHNEIDANLAGE
Title (fr)
PROCÉDÉ DE DÉCOUPE LASER ET INSTALLATION DE DÉCOUPE LASER
Publication
Application
Priority
- DE 102020205948 A 20200512
- EP 2021062440 W 20210511
Abstract (en)
[origin: WO2021228829A1] The invention relates to a method for the laser cutting of a workpiece (14) with a thickness (16) of less than 6 mm, wherein a first laser beam (18), a second laser beam (20) and a gas stream are directed onto an entry surface (24) of the workpiece (14), wherein the laser beams (18, 20) at least partially overlap one another on the workpiece (14), wherein the first laser beam (18) has a smaller focal diameter than the second laser beam (20), wherein the beam-parameter product of the first laser beam (18) is at most 5 mm*mrad, wherein a power component of the second laser beam (20) as a proportion of the overall laser power is less than 20%, and wherein a cutting gap with a broken cutting edge is formed on the entry surface (24) of the workpiece (14). The invention also relates to a laser-cutting installation (10) for the laser cutting of a workpiece (14) in the form of a metal sheet along a cutting line, having a laser light source device (28) for overlaying a first laser beam (18) and a second laser beam (20) in a cutting zone (26), wherein the first laser beam (18) has a smaller focal diameter (54) than the second laser beam (20), wherein the beam-parameter product of the first laser beam (18) is at most 5 mm*mrad, and wherein a power component of the second laser beam (20) as a proportion of the overall laser power is less than 20%, having a nozzle (37) for directing a gas stream onto the cutting zone (26), and having a movement device (66) for moving the cutting zone (26) along the cutting line in relation to the workpiece (14).
IPC 8 full level
B23K 26/06 (2006.01); B23K 26/38 (2006.01)
CPC (source: EP KR US)
B23K 26/0608 (2013.01 - EP KR US); B23K 26/0613 (2013.01 - EP KR); B23K 26/0626 (2013.01 - EP KR); B23K 26/14 (2013.01 - US); B23K 26/38 (2013.01 - EP KR US); Y02P 10/25 (2015.11 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DE 102020205948 A1 20211118; CN 115551668 A 20221230; EP 4149711 A1 20230322; JP 2023526242 A 20230621; JP 7443566 B2 20240305; KR 102675688 B1 20240614; KR 20220164607 A 20221213; US 2023111969 A1 20230413; WO 2021228829 A1 20211118
DOCDB simple family (application)
DE 102020205948 A 20200512; CN 202180034545 A 20210511; EP 2021062440 W 20210511; EP 21726600 A 20210511; JP 2022568782 A 20210511; KR 20227040012 A 20210511; US 202218053384 A 20221108