Global Patent Index - EP 4150751 A1

EP 4150751 A1 20230322 - ELECTRICAL MODULE WITH OVERMOULDING AND SYSTEMS COMPRISING SUCH AN ELECTRICAL MODULE

Title (en)

ELECTRICAL MODULE WITH OVERMOULDING AND SYSTEMS COMPRISING SUCH AN ELECTRICAL MODULE

Title (de)

ELEKTRISCHES MODUL MIT UMSPRITZUNG UND SYSTEME MIT SOLCH EINEM ELEKTRISCHEN MODUL

Title (fr)

MODULE ÉLECTRIQUE AVEC SURMOULAGE ET SYSTÈMES COMPRENANT UN TEL MODULE ÉLECTRIQUE

Publication

EP 4150751 A1 20230322 (FR)

Application

EP 21723304 A 20210510

Priority

  • FR 2004620 A 20200511
  • EP 2021062331 W 20210510

Abstract (en)

[origin: WO2021228767A1] The invention relates to an electrical module (110) comprising first (3041) and second (3042) electrical connection parts each having a main plate (3061, 3062), the main plates (3061, 3062) extending along the same main plane (PP); a first electrical component (1121) mounted on an upper face of the main plate (3061) of the first electrical connection part (3041); a first electrical link element (3261) electrically connecting said at least one electrical component (1121) to the upper face of the main plate (3062) of the second electrical connection part (3042); and an electrically insulating overmoulding (402), for example made of resin, covering at least part of the upper face of the main plate (3061, 3062) of the first (3041) and second (3042) electrical connection parts; said electrical module being characterised in that the upper face of the electrically insulating overmoulding (402) has a first cavity (C1) located at least partially above the first electrical link element (3261).

IPC 8 full level

H02M 7/00 (2006.01)

CPC (source: EP KR)

H01L 23/31 (2013.01 - KR); H01L 23/367 (2013.01 - KR); H01L 23/4952 (2013.01 - KR); H01L 23/49555 (2013.01 - KR); H01L 23/49562 (2013.01 - KR); H01L 23/49575 (2013.01 - KR); H01L 23/62 (2013.01 - KR); H01L 25/072 (2013.01 - KR); H02M 7/003 (2013.01 - EP KR); H02M 7/53871 (2013.01 - EP); H05K 7/1432 (2013.01 - KR); H05K 7/14322 (2022.08 - EP); H05K 7/14329 (2022.08 - EP); H05K 7/209 (2013.01 - EP); H01L 2224/0603 (2013.01 - EP); H01L 2224/40245 (2013.01 - EP); H01L 2224/48247 (2013.01 - EP)

Citation (search report)

See references of WO 2021228767A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

FR 3110034 A1 20211112; FR 3110034 B1 20220408; CN 115516749 A 20221223; EP 4150751 A1 20230322; KR 20230009891 A 20230117; WO 2021228767 A1 20211118

DOCDB simple family (application)

FR 2004620 A 20200511; CN 202180034481 A 20210510; EP 2021062331 W 20210510; EP 21723304 A 20210510; KR 20227039188 A 20210510