Global Patent Index - EP 4151776 A1

EP 4151776 A1 20230322 - ELECTROFORMING MASTER, METHOD FOR PRODUCING ELECTROFORMING MASTER, AND METHOD FOR PRODUCING ELECTROFORMING MATERIAL

Title (en)

ELECTROFORMING MASTER, METHOD FOR PRODUCING ELECTROFORMING MASTER, AND METHOD FOR PRODUCING ELECTROFORMING MATERIAL

Title (de)

GALVANOPLASTIK-MASTER, VERFAHREN ZUR HERSTELLUNG DES GALVANOPLASTIK-MASTERS UND VERFAHREN ZUR HERSTELLUNG EINES GALVANOPLASTIK-MATERIALS

Title (fr)

MATRICE D'ÉLECTROFORMAGE, PROCÉDÉ DE PRODUCTION DE MATRICE D'ÉLECTROFORMAGE ET PROCÉDÉ DE PRODUCTION D'UN MATÉRIAU D'ÉLECTROFORMAGE

Publication

EP 4151776 A1 20230322 (EN)

Application

EP 22194324 A 20220907

Priority

JP 2021152119 A 20210917

Abstract (en)

An electroforming master including an n-type semiconductor, and a substrate provided with a pattern on a surface thereof, in which an oxide film is formed on the surface, and a thickness of the oxide film is 18 Å or smaller, a method for producing the above-described electroforming master, and a method for producing an electroforming material using the above-described electroforming master.

IPC 8 full level

C25D 1/00 (2006.01); C25D 1/22 (2006.01)

CPC (source: EP US)

C25D 1/003 (2013.01 - EP); C25D 1/20 (2013.01 - US); C25D 1/22 (2013.01 - EP)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4151776 A1 20230322; JP 2023044211 A 20230330; US 2023092396 A1 20230323

DOCDB simple family (application)

EP 22194324 A 20220907; JP 2021152119 A 20210917; US 202217930718 A 20220909