EP 4155024 A1 20230329 - MACHINING METHOD AND MACHINING DEVICE HAVING HIGH EFFICIENCY AND LOW DAMAGE
Title (en)
MACHINING METHOD AND MACHINING DEVICE HAVING HIGH EFFICIENCY AND LOW DAMAGE
Title (de)
BEARBEITUNGSVERFAHREN UND BEARBEITUNGSVORRICHTUNG MIT HOHEM WIRKUNGSGRAD UND GERINGER BESCHÄDIGUNG
Title (fr)
PROCÉDÉ D'USINAGE ET DISPOSITIF D'USINAGE À HAUT RENDEMENT ET FAIBLE ENDOMMAGEMENT
Publication
Application
Priority
- CN 202010426289 A 20200519
- CN 2020132300 W 20201127
Abstract (en)
Disclosed are a machining method and a machining device improving machining efficiency and preserving workpiece surface integrity. The machining method improving machining efficiency and preserving workpiece surface integrity includes: setting a workpiece (300) and a machining unit (400); and machining the workpiece (300) by the machining unit (400) at a preset machining speed, wherein the preset machining speed is not lower than a machining speed corresponding to the embrittlement of the workpiece material. The machining device improving machining efficiency and preserving workpiece surface integrity is used for executing the machining method having the same merits. The machining device includes: a base (100) used for mounting the workpiece (300) and the machining unit (400), and a driving unit (200) connected to the machining unit (400) and used for driving the machining unit (400) to the preset machining speed. By the machining method, the machining speed of the machining unit (400) is set during machining, which results in "skin effect" of subsurface damage caused by the embrittlement of the workpiece material (300) and enables the damage depth of the workpiece (300) to be confined in a shallow subsurface layer, so that the damage depth of the workpiece (300) is reduced, the workpiece integrity is preserved, and the machining quality and the machining efficiency are improved.
IPC 8 full level
B24B 1/00 (2006.01); B23C 3/00 (2006.01); B23P 13/00 (2006.01); B24B 1/04 (2006.01); B24B 49/00 (2006.01)
CPC (source: CN EP US)
B24B 1/00 (2013.01 - CN EP); B24B 1/04 (2013.01 - CN US); B24B 49/00 (2013.01 - CN); B24B 49/006 (2013.01 - EP US); B24B 49/10 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4155024 A1 20230329; EP 4155024 A4 20231115; CN 111618665 A 20200904; CN 111618665 B 20220329; JP 2023516642 A 20230420; US 2023143368 A1 20230511; WO 2021232735 A1 20211125
DOCDB simple family (application)
EP 20937035 A 20201127; CN 202010426289 A 20200519; CN 2020132300 W 20201127; JP 2022552329 A 20201127; US 202017802283 A 20201127