Global Patent Index - EP 4155427 B1

EP 4155427 B1 20240814 - AL-PLATED HOT STAMPED STEEL MATERIAL

Title (en)

AL-PLATED HOT STAMPED STEEL MATERIAL

Title (de)

AL-PLATTIERTES FORMGEHÄRTETES STAHLMATERIAL

Title (fr)

MATÉRIAU EN ACIER ESTAMPÉ À CHAUD PLAQUÉ AVEC DE L'AL

Publication

EP 4155427 B1 20240814 (EN)

Application

EP 21809842 A 20210324

Priority

  • JP 2020086561 A 20200518
  • JP 2021012395 W 20210324

Abstract (en)

[origin: EP4155427A1] Provided is an Al-plated hot stamped steel material comprising a steel base material, an Al-plating layer formed on at least one surface of the steel base material, and a chemical conversion coating formed on the Al-plating layer and containing zinc phosphate-based crystals and Ce-based compounds deposited on the surfaces of the zinc phosphate-based crystals, wherein an amount of deposition of the zinc phosphate-based crystals in the chemical conversion coating is, converted to metal Zn, 0.3 to 4.0 g/m<sup>2</sup> and an area ratio of the Ce-based compounds in the chemical conversion coating is 0.5 to 25%.

IPC 8 full level

C23C 2/12 (2006.01); C23C 22/12 (2006.01); C23C 22/73 (2006.01); B32B 15/01 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/14 (2006.01); C22C 38/38 (2006.01); C25D 3/22 (2006.01); C25D 3/48 (2006.01)

CPC (source: EP KR US)

B32B 15/012 (2013.01 - US); C23C 2/12 (2013.01 - EP KR US); C23C 22/12 (2013.01 - EP KR US); C23C 22/73 (2013.01 - EP); C23C 22/78 (2013.01 - US); C23C 28/321 (2013.01 - KR US); C23C 28/34 (2013.01 - KR US); B32B 15/013 (2013.01 - EP); C22C 38/001 (2013.01 - US); C22C 38/002 (2013.01 - US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/06 (2013.01 - US); C22C 38/14 (2013.01 - EP US); C22C 38/38 (2013.01 - EP); C25D 3/22 (2013.01 - EP); C25D 3/48 (2013.01 - EP)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 4155427 A1 20230329; EP 4155427 A4 20230329; EP 4155427 B1 20240814; CN 115443350 A 20221206; CN 115443350 B 20240102; JP 7453583 B2 20240321; JP WO2021235083 A1 20211125; KR 20220156925 A 20221128; MX 2022014404 A 20221207; US 11905600 B2 20240220; US 2023138051 A1 20230504; WO 2021235083 A1 20211125

DOCDB simple family (application)

EP 21809842 A 20210324; CN 202180031244 A 20210324; JP 2021012395 W 20210324; JP 2022524293 A 20210324; KR 20227036786 A 20210324; MX 2022014404 A 20210324; US 202117910289 A 20210324