EP 4165126 A1 20230419 - POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
Title (en)
POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
Title (de)
POLYAMIDZUSAMMENSETZUNGEN MIT HOHEM MODUL UND NIEDRIGER DIELEKTRIZITÄTSKONSTANTE UND VERWENDUNG DAVON
Title (fr)
COMPOSITIONS DE POLYAMIDE PRESENTANT UN MODULE ELEVE ET UNE FAIBLE CONSTANTE DIELECTRIQUE ET LEUR UTILISATION
Publication
Application
Priority
- FR 2006054 A 20200610
- FR 2021051033 W 20210609
Abstract (en)
[origin: WO2021250352A1] The present invention relates to the use of a mixture of solid and hollow glass reinforcers with an alloy consisting of at least one polyamide and of at least one polyolefin, said mixture of solid and hollow glass reinforcers comprising from 5% to 60% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, in particular from 5% to 55% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, more particularly from 5% to 45% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, the alloy-mixture proportions being from more than 50% to 75%, in particular from 55% to 70%, notably from 55% to 65% of said alloy and from 25% to less than 50%, in particular from 30% to 45%, notably from 35% to 45% by weight of said mixture of solid and hollow glass reinforcers, to prepare a composition having a modulus, when dry at 20°C, of from 5 GPa to less than 8 GPa, in particular from 6 GPa to less than 8 GPa, and a dielectric constant Dk of less than or equal to 3.1, notably less than or equal to 3.0, in particular less than or equal to 2.9 as measured according to ASTM D‐2520‐13, at a frequency of at least 1 GHz, notably at a frequency of at least 2 GHz, in particular at a frequency of at least 3 GHz, at 23°C, under 50% RH.
IPC 8 full level
C08K 7/14 (2006.01); B29C 45/00 (2006.01); C08K 7/28 (2006.01); C08L 77/00 (2006.01)
CPC (source: EP KR US)
B29C 45/0001 (2013.01 - US); B29C 45/0005 (2013.01 - KR US); C08G 69/36 (2013.01 - EP KR); C08K 7/14 (2013.01 - KR US); C08K 7/28 (2013.01 - KR US); C08L 23/12 (2013.01 - KR); C08L 51/06 (2013.01 - KR US); C08L 77/00 (2013.01 - KR); C08L 77/06 (2013.01 - EP US); B01D 2247/02 (2013.01 - KR); B01D 2255/20707 (2013.01 - KR); B01D 2255/2092 (2013.01 - KR); B01D 2255/50 (2013.01 - KR); B29C 45/0005 (2013.01 - EP); B29K 2023/10 (2013.01 - US); B29K 2077/00 (2013.01 - US); B29K 2309/08 (2013.01 - US); C08K 2201/014 (2013.01 - US); F01N 2510/068 (2013.01 - KR); F01N 2610/02 (2013.01 - KR); F01N 2610/03 (2013.01 - KR); Y02T 10/12 (2013.01 - KR)
Citation (search report)
See references of WO 2021250352A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
FR 3111351 A1 20211217; FR 3111351 B1 20220909; CN 115702198 A 20230214; EP 4165126 A1 20230419; JP 2023529869 A 20230712; KR 20230025693 A 20230222; US 2023220202 A1 20230713; WO 2021250352 A1 20211216
DOCDB simple family (application)
FR 2006054 A 20200610; CN 202180041972 A 20210609; EP 21736630 A 20210609; FR 2021051033 W 20210609; JP 2022574778 A 20210609; KR 20237000670 A 20210609; US 202118001158 A 20210609