Global Patent Index - EP 4165138 A1

EP 4165138 A1 20230419 - TWO-COMPONENT CURING COMPOSITION FOR METAL SURFACE TREATMENT, METHOD FOR MOUNTING FILM ON METAL SURFACE, AND SURFACE STRUCTURE

Title (en)

TWO-COMPONENT CURING COMPOSITION FOR METAL SURFACE TREATMENT, METHOD FOR MOUNTING FILM ON METAL SURFACE, AND SURFACE STRUCTURE

Title (de)

ZWEIKOMPONENTIGE HÄRTUNGSZUSAMMENSETZUNG ZUR METALLOBERFLÄCHENBEHANDLUNG, VERFAHREN ZUR MONTAGE EINES FILMS AUF EINER METALLOBERFLÄCHE UND OBERFLÄCHENSTRUKTUR

Title (fr)

COMPOSITION DE DURCISSEMENT À DEUX COMPOSANTS POUR LE TRAITEMENT D'UNE SURFACE MÉTALLIQUE, PROCÉDÉ D'APPLICATION D'UN FILM SUR UNE SURFACE MÉTALLIQUE ET STRUCTURE DE SURFACE

Publication

EP 4165138 A1 20230419 (EN)

Application

EP 21821892 A 20210609

Priority

  • CN 202010526058 A 20200610
  • IB 2021055078 W 20210609

Abstract (en)

[origin: WO2021250595A1] A two-component curing composition for metal surface treatment, a method for mounting a film on a metal surface, and a surface structure are provided in the present invention. The two-component curing composition comprises: 15-35 wt% of a liquid epoxy resin; 20-35 wt% of a curing agent for epoxy resin; 5-15 wt% of a diluent; 10-25 wt% of a weight reducing agent; and 5-20 wt% of a flame retardant; wherein the two-component curing composition comprises a part A and a part B, the part A comprising the liquid epoxy resin, the part B comprising the curing agent for epoxy resin, and the diluent, the weight reducing agent and the flame retardant are present in one or both of the part A and the part B. The two-component curing composition for metal surface treatment has good open time and surface drying time when applied, and has a very high bonding strength to the metal surface to be treated and aging resistance. By means of the use of the composition, convenient, simple, and quick mounting of a film on the metal surface (e.g., a surface of a vehicle body) can be realized.

IPC 8 full level

C09D 163/00 (2006.01); B32B 15/082 (2006.01); B32B 15/09 (2006.01); B32B 15/095 (2006.01); C08K 3/04 (2006.01); C08K 3/32 (2006.01); C08K 5/17 (2006.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09K 21/04 (2006.01)

CPC (source: CN EP)

B05D 7/16 (2013.01 - CN); B32B 7/12 (2013.01 - CN EP); B32B 15/082 (2013.01 - CN EP); B32B 15/09 (2013.01 - CN EP); B32B 15/095 (2013.01 - CN EP); B32B 15/18 (2013.01 - EP); B32B 27/06 (2013.01 - CN); B32B 27/30 (2013.01 - CN); B32B 27/304 (2013.01 - EP); B32B 27/36 (2013.01 - CN EP); B32B 27/40 (2013.01 - CN EP); B32B 33/00 (2013.01 - CN); C08G 59/226 (2013.01 - EP); C08G 59/38 (2013.01 - EP); C08G 59/686 (2013.01 - EP); C09D 5/00 (2013.01 - EP); C09D 7/61 (2018.01 - CN EP); C09D 7/63 (2018.01 - CN EP); C09D 7/65 (2018.01 - CN); C09D 7/70 (2018.01 - CN); C09D 163/00 (2013.01 - CN EP); B05D 1/30 (2013.01 - EP); B05D 1/42 (2013.01 - EP); B05D 2202/10 (2013.01 - EP); B05D 2203/35 (2013.01 - EP); B05D 2301/00 (2013.01 - CN); B05D 2320/00 (2013.01 - CN); B05D 2504/00 (2013.01 - CN EP); B05D 2601/20 (2013.01 - EP); B32B 2255/06 (2013.01 - CN EP); B32B 2255/26 (2013.01 - CN EP); B32B 2307/712 (2013.01 - EP); B32B 2307/732 (2013.01 - EP); B32B 2307/748 (2013.01 - EP); B32B 2605/00 (2013.01 - CN EP); B44C 1/105 (2013.01 - EP); C08K 7/24 (2013.01 - EP); C08K 7/28 (2013.01 - EP); C08K 2003/026 (2013.01 - EP); C08K 2003/323 (2013.01 - EP); C08K 2201/005 (2013.01 - CN); C08L 2201/08 (2013.01 - CN); Y02E 60/10 (2013.01 - EP)

C-Set (source: CN EP)

CN

C09D 163/00 + C08L 67/00 + C08K 13/04 + C08K 7/20 + C08K 7/24 + C08K 5/1345

EP

  1. C09D 163/00 + C08K 3/22 + C08L 63/00
  2. C09D 163/00 + C08K 3/32 + C08L 63/00 + C08K 3/04 + C08K 7/28
  3. C09D 163/00 + C08L 63/00 + C08K 3/02 + C08K 7/28

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2021250595 A1 20211216; CN 113773726 A 20211210; CN 113773726 B 20230822; EP 4165138 A1 20230419; JP 2023531598 A 20230725

DOCDB simple family (application)

IB 2021055078 W 20210609; CN 202010526058 A 20200610; EP 21821892 A 20210609; JP 2022575884 A 20210609