Global Patent Index - EP 4172124 A1

EP 4172124 A1 20230503 - MATERIAL COMPRISING A STACK WITH A THIN ZINC-BASED OXIDE DIELECTRIC SUBLAYER AND METHOD FOR DEPOSITING SAID MATERIAL

Title (en)

MATERIAL COMPRISING A STACK WITH A THIN ZINC-BASED OXIDE DIELECTRIC SUBLAYER AND METHOD FOR DEPOSITING SAID MATERIAL

Title (de)

MATERIAL MIT EINEM STAPEL MIT EINER DÜNNEN DIELEKTRISCHEN SCHICHT AUS ZINKBASIERTEM OXID UND VERFAHREN ZUR ABSCHEIDUNG DIESES MATERIALS

Title (fr)

MATERIAU COMPORTANT UN EMPILEMENT A SOUS-COUCHE DIELECTRIQUE FINE D'OXIDE A BASE DE ZINC ET PROCEDE DE DEPOT DE CE MATERIAU

Publication

EP 4172124 A1 20230503 (FR)

Application

EP 21740594 A 20210616

Priority

  • FR 2006611 A 20200624
  • FR 2021051083 W 20210616

Abstract (en)

[origin: WO2021260297A1] The invention relates to a material comprising a substrate (30) coated on one face (29) with a stack of thin layers (14) comprising at least one metal functional layer (140) and comprising: - an underlayer of zinc-based oxide, ZnO (129), between 0.3 and 5.0 nm thick; - a dielectric underlayer of titanium-based oxide, TiOx (127), which is located under and in contact with said underlayer of zinc-based oxide, ZnO (129), with a thickness of between 5.0 and 50.0 nm; - a capping layer of titanium-based oxide, TiOx (150), between 0.3 and 5.0 nm thick; - an overlayer of zinc-based oxide, ZnO (161), between 2.0 and 10.0 nm thick; and - a dielectric overlayer (165).

IPC 8 full level

C03C 17/36 (2006.01)

CPC (source: EP)

C03C 17/36 (2013.01); C03C 17/3618 (2013.01); C03C 17/3626 (2013.01); C03C 17/3642 (2013.01); C03C 17/3644 (2013.01); C03C 17/366 (2013.01); C03C 2217/944 (2013.01)

Citation (search report)

See references of WO 2021260297A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

FR 3111891 A1 20211231; EP 4172124 A1 20230503; WO 2021260297 A1 20211230

DOCDB simple family (application)

FR 2006611 A 20200624; EP 21740594 A 20210616; FR 2021051083 W 20210616