EP 4172276 A1 20230503 - THERMALLY CONDUCTIVE SILICONE COMPOSITIONS
Title (en)
THERMALLY CONDUCTIVE SILICONE COMPOSITIONS
Title (de)
WÄRMELEITFÄHIGE SILIKONZUSAMMENSETZUNGEN
Title (fr)
COMPOSITIONS SILICONES THERMOCONDUCTRICES
Publication
Application
Priority
- FR 2006652 A 20200625
- FR 2021000066 W 20210624
Abstract (en)
[origin: WO2021260279A1] The present invention relates to organopolysiloxane compositions comprising an organopolysiloxane having, per molecule, at least two alkenyl groups, an organopolysiloxane having, per molecule, at least two SiH units, a hydrosilylation catalyst, and a thermally conductive filler, the thermally conductive filler comprising at least 40% by weight of metallic silicon, and a specific particle size distribution. The invention further relates to a silicone elastomer which can be obtained by cross-linking and/or curing the composition, as well as its use as a thermally conductive material for coating or filling, in particular for the automotive field, in particular for the field of electric vehicles.
IPC 8 full level
C09C 3/10 (2006.01); C08G 77/00 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 3/02 (2006.01); C08K 3/22 (2006.01); C08L 83/00 (2006.01); C08L 83/04 (2006.01); C09C 1/28 (2006.01); C09K 5/00 (2006.01)
CPC (source: EP KR US)
C08G 77/12 (2013.01 - EP KR); C08G 77/20 (2013.01 - EP KR); C08J 3/24 (2013.01 - US); C08K 3/02 (2013.01 - US); C08K 3/22 (2013.01 - KR US); C08L 83/04 (2013.01 - EP KR US); C09C 1/043 (2013.01 - EP KR); C09C 1/28 (2013.01 - EP KR); C09C 1/407 (2013.01 - EP KR); C09C 3/12 (2013.01 - EP KR); C01P 2004/51 (2013.01 - EP); C01P 2004/61 (2013.01 - EP); C08J 2383/07 (2013.01 - US); C08K 2003/023 (2013.01 - EP KR US); C08K 2003/2227 (2013.01 - EP KR US); C08K 2201/001 (2013.01 - US); Y02E 60/10 (2013.01 - EP)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2021260279 A1 20211230; CN 116209720 A 20230602; EP 4172276 A1 20230503; JP 2023533466 A 20230803; KR 20230029862 A 20230303; US 2023250283 A1 20230810
DOCDB simple family (application)
FR 2021000066 W 20210624; CN 202180055532 A 20210624; EP 21740116 A 20210624; JP 2022580193 A 20210624; KR 20237002650 A 20210624; US 202118003206 A 20210624