Global Patent Index - EP 4172377 A1

EP 4172377 A1 20230503 - NOZZLE ASSEMBLY, EVAPORATION SOURCE, DEPOSITION SYSTEM AND METHOD FOR DEPOSITING AN EVAPORATED MATERIAL ONTO A SUBSTRATE

Title (en)

NOZZLE ASSEMBLY, EVAPORATION SOURCE, DEPOSITION SYSTEM AND METHOD FOR DEPOSITING AN EVAPORATED MATERIAL ONTO A SUBSTRATE

Title (de)

DÜSENANORDNUNG, VERDAMPFUNGSQUELLE, ABSCHEIDUNGSSYSTEM UND VERFAHREN ZUR ABSCHEIDUNG EINES VERDAMPFTEN MATERIALS AUF EINEM SUBSTRAT

Title (fr)

ENSEMBLE BUSE, SOURCE D'ÉVAPORATION, SYSTÈME DE DÉPÔT ET PROCÉDÉ DE DÉPÔT D'UN MATÉRIAU ÉVAPORÉ SUR UN SUBSTRAT

Publication

EP 4172377 A1 20230503 (EN)

Application

EP 20735377 A 20200629

Priority

EP 2020068257 W 20200629

Abstract (en)

[origin: WO2022002349A1] A nozzle assembly for guiding an evaporated material to a substrate is described. The nozzles assembly includes a plurality of nozzles, one or more nozzles of the plurality of nozzles include: a first nozzle section having a first end and a second end, the first nozzle section comprising a vapor outlet at the second end, and an orifice at or adjacent to the vapor outlet having an orifice diameter.

IPC 8 full level

C23C 14/24 (2006.01); C23C 14/16 (2006.01); C23C 14/56 (2006.01); H01M 4/04 (2006.01); H01M 4/38 (2006.01)

CPC (source: EP KR)

C23C 14/16 (2013.01 - EP KR); C23C 14/228 (2013.01 - KR); C23C 14/243 (2013.01 - EP KR); C23C 14/26 (2013.01 - EP); C23C 14/562 (2013.01 - EP KR); C23C 14/564 (2013.01 - EP KR); C23C 14/568 (2013.01 - EP KR); H01M 4/0423 (2013.01 - EP KR); H01M 4/1395 (2013.01 - EP KR); H01M 4/382 (2013.01 - EP KR); Y02E 60/10 (2013.01 - EP KR)

Citation (search report)

See references of WO 2022002349A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2022002349 A1 20220106; CN 115768916 A 20230307; EP 4172377 A1 20230503; JP 2023540659 A 20230926; KR 20230030645 A 20230306; TW 202219297 A 20220516; TW I825433 B 20231211

DOCDB simple family (application)

EP 2020068257 W 20200629; CN 202080102314 A 20200629; EP 20735377 A 20200629; JP 2022580393 A 20200629; KR 20237003099 A 20200629; TW 110122276 A 20210618