EP 4177376 A1 20230510 - METAL DISPLACEMENT SOLUTION AND CORRESPONDING METHOD FOR SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY
Title (en)
METAL DISPLACEMENT SOLUTION AND CORRESPONDING METHOD FOR SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY
Title (de)
METALLVERDRÄNGUNGSLÖSUNG UND ENTSPRECHENDES VERFAHREN ZUR OBERFLÄCHENBEHANDLUNG VON ALUMINIUM ODER ALUMINIUMLEGIERUNGEN
Title (fr)
SOLUTION DE DÉPLACEMENT DE METAL ET PROCÉDÉ CORRESPONDANT POUR LE TRAITEMENT DE SURFACE DE L'ALUMINIUM OU DE L'ALLIAGE D'ALUMINIUM
Publication
Application
Priority
JP 2021182009 A 20211108
Abstract (en)
The present invention aims to provide a metal displacement solution that can provide good adhesion to a plating film (metal film), and a method for surface treatment of aluminum or an aluminum alloy using the metal displacement solution. Included is a metal displacement solution which contains a zinc compound, a nickel compound, a germanium compound, and a fluorine compound.
IPC 8 full level
C23C 18/54 (2006.01); C23C 18/18 (2006.01); C25D 5/44 (2006.01)
CPC (source: CN EP KR US)
C23C 18/08 (2013.01 - US); C23C 18/1824 (2013.01 - US); C23C 18/1831 (2013.01 - EP); C23C 18/1841 (2013.01 - EP); C23C 18/32 (2013.01 - US); C23C 18/48 (2013.01 - CN); C23C 18/54 (2013.01 - EP KR); C23C 28/023 (2013.01 - KR); C23F 1/20 (2013.01 - EP); C23G 1/125 (2013.01 - EP); C25D 5/44 (2013.01 - EP)
Citation (applicant)
- JP 2000256864 A 20000919 - OKUNO CHEM IND CO
- JP 2020196914 A 20201210 - OKUNO CHEM IND CO
- JP 2009127101 A 20090611 - UYEMURA C & CO LTD
- JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 64, no. 12, 2013, pages 645 - 649
- JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 66, no. 12, 2015, pages 658 - 665
- JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 47, no. 9, 1996, pages 802 - 807
Citation (search report)
- [XI] US 3930081 A 19751230 - SHINOMIYA HIROSHI, et al
- [Y] JP 2010163640 A 20100729 - NIHON PARKERIZING
- [Y] US 2005008788 A1 20050113 - JOSHI NAYAN H [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4177376 A1 20230510; CN 114807918 A 20220729; JP 2023069841 A 20230518; KR 20230067550 A 20230516; TW 202336272 A 20230916; US 2023151493 A1 20230518
DOCDB simple family (application)
EP 22204326 A 20221028; CN 202210500745 A 20220428; JP 2021182009 A 20211108; KR 20220147573 A 20221108; TW 111140222 A 20221024; US 202218052569 A 20221103