Global Patent Index - EP 4179569 A1

EP 4179569 A1 20230517 - ELECTRONIC POWER MODULE, ELECTRICAL SYSTEM COMPRISING SUCH A MODULE, CORRESPONDING MANUFACTURING METHODS

Title (en)

ELECTRONIC POWER MODULE, ELECTRICAL SYSTEM COMPRISING SUCH A MODULE, CORRESPONDING MANUFACTURING METHODS

Title (de)

ELEKTRONISCHES LEISTUNGSMODUL, ELEKTRISCHES SYSTEM MIT SOLCH EINEM MODUL UND ZUGEHÖRIGE HERSTELLUNGSVERFAHREN

Title (fr)

MODULE ÉLECTRONIQUE DE PUISSANCE, SYSTÈME ÉLECTRIQUE COMPORTANT UN TEL MODULE, PROCÉDÉS DE FABRICATION CORRESPONDANTS

Publication

EP 4179569 A1 20230517 (FR)

Application

EP 21734841 A 20210623

Priority

  • FR 2007367 A 20200710
  • EP 2021067106 W 20210623

Abstract (en)

[origin: WO2022008244A1] The invention relates to an electronic power module (107) comprising: - at least one electronic chip (201); and - an electrically insulating overmoulded block (214) at least partially encasing each chip (201). Said module (107) comprises at least one projection (218, 220) for supporting a component, such as an electronic control board (208) for controlling each chip, the projection (218, 220) comprising an electrically insulating material and extending from a face (216a) of the block (214).

IPC 8 full level

H01L 25/16 (2023.01); H01L 21/56 (2006.01)

CPC (source: EP US)

H01L 21/56 (2013.01 - US); H01L 23/3121 (2013.01 - US); H01L 25/072 (2013.01 - US); H01L 25/162 (2013.01 - EP); H05K 1/18 (2013.01 - US); H01L 23/3121 (2013.01 - EP); H01L 25/072 (2013.01 - EP); H05K 2201/10166 (2013.01 - US); H05K 2201/10568 (2013.01 - US); H05K 2201/10901 (2013.01 - US)

Citation (search report)

See references of WO 2022008244A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

FR 3112424 A1 20220114; FR 3112424 B1 20230512; CN 116802778 A 20230922; EP 4179569 A1 20230517; JP 2023533389 A 20230802; US 2023274994 A1 20230831; WO 2022008244 A1 20220113

DOCDB simple family (application)

FR 2007367 A 20200710; CN 202180054222 A 20210623; EP 2021067106 W 20210623; EP 21734841 A 20210623; JP 2023524982 A 20210623; US 202118005021 A 20210623