EP 4182519 A1 20230524 - MODULAR FLOOR SYSTEM AND MODULES THEREFOR
Title (en)
MODULAR FLOOR SYSTEM AND MODULES THEREFOR
Title (de)
MODULARES BODENSYSTEM UND MODULE DAFÜR
Title (fr)
SYSTÈME DE PLANCHER MODULAIRE ET MODULES ASSOCIÉS
Publication
Application
Priority
- IL 27614020 A 20200719
- IL 2021050874 W 20210718
Abstract (en)
[origin: WO2022018720A1] A modular raised floor module and raised floor systems constructed therefrom are disclosed. The raised floor module comprising a base floor and a top floor, with a plurality of support pedestals disposed between the base floor and a top floor, wherein the plurality of support pedestals are configured for supporting and leveling the base floor above a bearing surface and for supporting the top floor at a spaced apart relation over the base floor, thereby forming a service space extending between a top face of the base floor and a bottom face of the top floor. The raised floor modules are articulable to one another along their neighboring edges. The base floor can be configured with an inclined surface for draining liquids within the service space towards a liquid collecting portion, for removing liquids from the service space.
IPC 8 full level
E04F 15/024 (2006.01)
CPC (source: EP IL US)
E04B 2/7433 (2013.01 - EP); E04F 15/02405 (2013.01 - EP US); E04F 15/02447 (2013.01 - IL); E04F 15/02452 (2013.01 - EP IL); E04F 15/02458 (2013.01 - IL US); E04F 15/02464 (2013.01 - IL); E04F 15/0247 (2013.01 - IL US); E04F 15/02476 (2013.01 - EP); E04B 1/8218 (2013.01 - EP); E04B 2/7433 (2013.01 - US); E04B 2001/0092 (2013.01 - EP); E04B 2002/7446 (2013.01 - EP); E04B 2002/7483 (2013.01 - EP); E04B 2002/7488 (2013.01 - EP); F04B 49/06 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2022018720 A1 20220127; EP 4182519 A1 20230524; EP 4182519 A4 20240117; IL 276140 B 20210831; JP 2023534707 A 20230810; US 2023349171 A1 20231102
DOCDB simple family (application)
IL 2021050874 W 20210718; EP 21846480 A 20210718; IL 27614020 A 20200719; JP 2023504222 A 20210718; US 202118016933 A 20210718