Global Patent Index - EP 4189710 A1

EP 4189710 A1 20230607 - A COMPONENT MOUNTING ASSEMBLY AND A METHOD FOR FIXING COMPONENT

Title (en)

A COMPONENT MOUNTING ASSEMBLY AND A METHOD FOR FIXING COMPONENT

Title (de)

KOMPONENTENMONTAGEANORDNUNG UND VERFAHREN ZUR BEFESTIGUNG EINER KOMPONENTE

Title (fr)

ENSEMBLE DE MONTAGE DE COMPOSANT ET PROCÉDÉ DE FIXATION DE COMPOSANT

Publication

EP 4189710 A1 20230607 (EN)

Application

EP 21751962 A 20210728

Priority

  • CN 202010742411 A 20200729
  • CN 2021108812 W 20210728

Abstract (en)

[origin: WO2022022545A1] The present disclosure proposes a component mounting assembly, which includes: a first component and a second component, the first component comprising a base and at least one leg extending from the base; and a fixing device comprising a bottom and at least one first fixing tab extending perpendicularly from the bottom, the bottom and the at least one first fixing tab defining an accommodating space; wherein the first component and the second component is received in the accommodating space with one of first component and the second component being located at the bottom, the other one is arranged face to face with respect to said the one of first component and the second component and fixed to said the one via the fixing device. The fixing device further includes a second fixing tab. The first and second fixing tabs may pass through the cutout of the printed circuit board, thereby fixing the fixing device, the first component and the second component to the printed circuit board. The present disclosure also proposes a corresponding method for fixing component.

IPC 8 full level

H01F 27/06 (2006.01); H01F 27/26 (2006.01); H01F 37/00 (2006.01); H05K 1/16 (2006.01)

CPC (source: CN EP)

H01F 3/14 (2013.01 - CN); H01F 27/06 (2013.01 - EP); H01F 27/263 (2013.01 - CN EP); H01F 37/00 (2013.01 - EP); H01F 41/0206 (2013.01 - CN); H05K 1/181 (2013.01 - EP); H05K 3/325 (2013.01 - EP); H01F 2027/065 (2013.01 - EP); H05K 2201/086 (2013.01 - EP); H05K 2201/09063 (2013.01 - EP); H05K 2201/1003 (2013.01 - EP); H05K 2201/10393 (2013.01 - EP); H05K 2201/10598 (2013.01 - EP); H05K 2201/10606 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)

Citation (search report)

See references of WO 2022022545A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2022022545 A1 20220203; CN 111986867 A 20201124; CN 111986867 B 20220517; EP 4189710 A1 20230607

DOCDB simple family (application)

CN 2021108812 W 20210728; CN 202010742411 A 20200729; EP 21751962 A 20210728