Global Patent Index - EP 4190850 A1

EP 4190850 A1 20230607 - ADDITIVE COMPOSITION, RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND MOLDED ARTICLE

Title (en)

ADDITIVE COMPOSITION, RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND MOLDED ARTICLE

Title (de)

ADDITIVZUSAMMENSETZUNG, HARZZUSAMMENSETZUNG, VERFAHREN ZUR HERSTELLUNG DER HARZZUSAMMENSETZUNG UND FORMKÖRPER

Title (fr)

COMPOSITION ADDITIVE, COMPOSITION DE RÉSINE, PROCÉDÉ DE PRODUCTION D'UNE COMPOSITION DE RÉSINE ET ARTICLE MOULÉ

Publication

EP 4190850 A1 20230607 (EN)

Application

EP 21850554 A 20210729

Priority

  • JP 2020130996 A 20200731
  • JP 2021028114 W 20210729

Abstract (en)

According to an additive composition which contains: (A) an aromatic phosphate sodium salt represented by the following Formula (1), where R<sup>1</sup> to R<sup>5</sup> each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; (B) a fatty acid sodium salt; and (C) talc, and in which a mass ratio (B)/(A) of the content of the component (B) with respect to the content of the component (A) is 0.1 to 3 and a mass ratio (C)/[(A) + (B) + (C)] of the content of the component (C) with respect to a total content of the components (A), (B), and (C) is 0.2 to 0.8, for example, an additive composition which has excellent powder flowability and can impart excellent mechanical properties and excellent color tone to a molded article can be provided.

IPC 8 full level

C08K 5/098 (2006.01); C08K 3/26 (2006.01); C08K 3/34 (2006.01); C08K 5/527 (2006.01); C08L 23/00 (2006.01); C08L 23/12 (2006.01)

CPC (source: EP US)

C08K 3/346 (2013.01 - EP US); C08K 5/098 (2013.01 - EP US); C08K 5/527 (2013.01 - EP US); C08K 2201/014 (2013.01 - US)

C-Set (source: EP)

  1. C08K 3/346 + C08L 23/12
  2. C08K 5/098 + C08L 23/12
  3. C08K 5/527 + C08L 23/12

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4190850 A1 20230607; CN 116323779 A 20230623; JP WO2022025187 A1 20220203; TW 202216880 A 20220501; US 2024043655 A1 20240208; WO 2022025187 A1 20220203

DOCDB simple family (application)

EP 21850554 A 20210729; CN 202180066221 A 20210729; JP 2021028114 W 20210729; JP 2022539565 A 20210729; TW 110128154 A 20210730; US 202118018649 A 20210729