EP 4191689 A1 20230607 - SEMICONDUCTOR LIGHT EMITTING DEVICE
Title (en)
SEMICONDUCTOR LIGHT EMITTING DEVICE
Title (de)
LICHTEMITTIERENDES HALBLEITERBAUELEMENT
Title (fr)
DISPOSITIF ÉLECTROLUMINESCENT À SEMI-CONDUCTEUR
Publication
Application
Priority
JP 2021196554 A 20211202
Abstract (en)
A semiconductor light emitting device 10 includes: a resin frame 11 having an opening 20; a lead frame 12 having leads 12a and 12b exposed in the opening 20; and an LED 28 placed in the opening 20 and connected to the leads 12a and 12b. Standing parts 18a are erected on an upper surface 23a of the lead 12a. The standing parts 18a are embedded in the resin of the frame 11.
IPC 8 full level
H01L 33/48 (2010.01); H01L 33/62 (2010.01)
CPC (source: EP US)
H01L 25/167 (2013.01 - US); H01L 33/486 (2013.01 - EP); H01L 33/50 (2013.01 - US); H01L 33/60 (2013.01 - US); H01L 33/62 (2013.01 - EP US); H01L 2933/0066 (2013.01 - US)
Citation (applicant)
- JP 2010062272 A 20100318 - NICHIA CORP
- JP 2006156704 A 20060615 - NICHIA KAGAKU KOGYO KK
Citation (search report)
- [X] US 2018097163 A1 20180405 - MORIKAWA TAKESHI [JP]
- [X] US 2012056218 A1 20120308 - ABDUL KARIM NORFIDATHUL AIZAR [MY], et al
- [X] EP 2541598 A1 20130102 - LG INNOTEK CO LTD [KR]
- [X] US 2012280375 A1 20121108 - SAKAI TATSUHIKO [JP], et al
- [X] US 2012025227 A1 20120202 - CHAN ALEX CHI KEUNG [CN], et al
- [X] KR 20090104512 A 20091006 - SEOUL SEMICONDUCTOR CO LTD [KR]
- [X] US 2019165233 A1 20190530 - HORIKAWA YUTA [JP], et al
- [X] US 2013187188 A1 20130725 - SASAOKA SHIMPEI [JP], et al
- [X] US 2012074456 A1 20120329 - JIN HONGBOEM [KR]
- [X] US 2013127034 A1 20130523 - HASEGAWA YUU [JP], et al
- [X] EP 3226312 A1 20171004 - NICHIA CORP [JP]
- [A] JP 2018061026 A 20180412 - NICHIA KAGAKU KOGYO KK
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4191689 A1 20230607; EP 4191689 B1 20240821; JP 2023082632 A 20230614; US 2023178699 A1 20230608
DOCDB simple family (application)
EP 22209237 A 20221123; JP 2021196554 A 20211202; US 202217991919 A 20221122