EP 4195888 A4 20240131 - ELECTRONIC DEVICE
Title (en)
ELECTRONIC DEVICE
Title (de)
ELEKTRONISCHE VORRICHTUNG
Title (fr)
DISPOSITIF ÉLECTRONIQUE
Publication
Application
Priority
- CN 2022113505 W 20220819
- CN 202111264152 A 20211028
Abstract (en)
[origin: EP4195888A1] Embodiments of this application provide an electronic device. The electronic device includes at least a housing, a mainboard, a conductive coil, and a conductive adapter. The housing includes an inner surface and an outer surface provided opposite to each other. The mainboard is arranged on the inner surface. The conductive coil is arranged on the inner surface and is integrally arranged with the housing. The conductive coil includes a winding portion, an outer connection terminal, and an inner connection terminal. In a radial direction of the winding portion, the mainboard is located at an outer side of the winding portion. The outer connection terminal is connected to the winding portion and is located at the outer side of the winding portion. The outer connection terminal is electrically connected to the mainboard. The inner connection terminal is connected to the winding portion and is located on an inner side of the winding portion. The conductive adapter is electrically connected to the mainboard and the inner connection terminal. The electronic device in the embodiments of this application can reduce the possibility that the conductive coil cannot be used normally due to low reliability of a connection between a wire coil and a mainboard bracket.
IPC 8 full level
H05K 5/02 (2006.01); H04M 1/02 (2006.01); H04M 1/72412 (2021.01)
CPC (source: CN EP)
H01F 27/02 (2013.01 - EP); H01F 27/23 (2013.01 - CN); H01F 27/2804 (2013.01 - CN EP); H01F 27/29 (2013.01 - CN); H01F 38/14 (2013.01 - CN EP); H02J 50/005 (2020.01 - EP); H02J 50/10 (2016.02 - CN EP); H04M 1/026 (2013.01 - EP); H04M 1/0277 (2013.01 - EP); H04M 1/72412 (2021.01 - EP); H05K 5/0217 (2013.01 - CN); H05K 5/0247 (2013.01 - CN); H02J 7/02 (2013.01 - EP); H04M 2250/04 (2013.01 - EP)
Citation (search report)
- [XI] US 2012274148 A1 20121101 - SUNG JAE SUK [KR], et al
- [I] CN 204732526 U 20151028 - SHENZHEN HAIDEMEN ELECTRONICS CO LTD
- [I] US 10263467 B2 20190416 - MOON SUNG-HOON [KR], et al
- [I] WO 2021128076 A1 20210701 - AAC ACOUSTIC TECH SHENZHEN CO LTD [CN], et al
- [I] CN 204216621 U 20150318 - JANUS DONGGUAN PREC COMPONENTS, et al
- See references of WO 2023071450A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4195888 A1 20230614; EP 4195888 A4 20240131; CN 114190022 A 20220315; CN 114190022 B 20221104; CN 115579228 A 20230106; WO 2023071450 A1 20230504
DOCDB simple family (application)
EP 22844420 A 20220819; CN 202111264152 A 20211028; CN 202211051092 A 20211028; CN 2022113505 W 20220819