EP 4204601 A1 20230705 - METHOD FOR METALLIZING A NON-METALLIC SUBSTRATE AND PRE-TREATMENT COMPOSITION
Title (en)
METHOD FOR METALLIZING A NON-METALLIC SUBSTRATE AND PRE-TREATMENT COMPOSITION
Title (de)
VERFAHREN ZUR METALLISIERUNG EINES NICHTMETALLISCHEN SUBSTRATS UND VORBEHANDLUNGSZUSAMMENSETZUNG
Title (fr)
PROCÉDÉ DE MÉTALLISATION D'UN SUBSTRAT NON MÉTALLIQUE ET COMPOSITION DE PRÉTRAITEMENT
Publication
Application
Priority
- EP 20192718 A 20200825
- EP 2021073224 W 20210823
Abstract (en)
[origin: WO2022043241A1] The present invention relates to a method for metallizing a non-metallic substrate, the method comprising the steps (A) to (C), wherein step (A) is a pre-treatment step for etching and step (C) the metallization step. In step (A) a pre-treatment composition is utilized comprising individual manganese (II), (III), and (IV) species. The present invention furthermore relates to a specific pre-treatment composition.
IPC 8 full level
C23C 18/24 (2006.01); C08J 7/14 (2006.01); C23C 18/16 (2006.01)
CPC (source: EP KR US)
C23C 18/1641 (2013.01 - US); C23C 18/1651 (2013.01 - EP KR); C23C 18/1653 (2013.01 - EP KR US); C23C 18/206 (2013.01 - US); C23C 18/24 (2013.01 - EP KR US); C23C 18/32 (2013.01 - KR); C23C 18/34 (2013.01 - KR); C23C 18/36 (2013.01 - US); C23C 18/38 (2013.01 - KR); C23C 28/023 (2013.01 - US); C25D 3/12 (2013.01 - US); C25D 5/56 (2013.01 - US)
Citation (search report)
See references of WO 2022043241A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2022043241 A1 20220303; BR 112023003111 A2 20230404; CA 3190838 A1 20220303; CN 116134175 A 20230516; EP 4204601 A1 20230705; JP 2023539605 A 20230915; KR 20230054853 A 20230425; US 2023357932 A1 20231109
DOCDB simple family (application)
EP 2021073224 W 20210823; BR 112023003111 A 20210823; CA 3190838 A 20210823; CN 202180052417 A 20210823; EP 21766456 A 20210823; JP 2023513484 A 20210823; KR 20237009607 A 20210823; US 202118042852 A 20210823