Global Patent Index - EP 4209619 A1

EP 4209619 A1 20230712 - PROCESS AND USE OF COPPER BASED ELECTROCATALYST MATERIAL IN SUPERSATURATED ELECTROLYTE

Title (en)

PROCESS AND USE OF COPPER BASED ELECTROCATALYST MATERIAL IN SUPERSATURATED ELECTROLYTE

Title (de)

VERFAHREN UND VERWENDUNG EINES ELEKTROKATALYTISCHEN MATERIALS AUF KUPFERBASIS IN EINEM ÜBERSÄTTIGTEN ELEKTROLYTEN

Title (fr)

PROCÉDÉ ET UTILISATION D'UN MATÉRIAU D'ÉLECTROCATALYSEUR À BASE DE CUIVRE DANS UN ÉLECTROLYTE SURSATURÉ

Publication

EP 4209619 A1 20230712 (EN)

Application

EP 22305020 A 20220111

Priority

EP 22305020 A 20220111

Abstract (en)

The present invention belongs to the field of catalytic chemistry, and more specifically to catalyzed reduction chemical reactions, preferably the reduction of CO<sub>2</sub> into small molecules.The present invention relates to a new copper based electrocatalyst material and its method of preparation comprising a step of in-situ electrodeposition or co-electrodeposition, in an electrolyte solution, of at least one catalytic metal in the presence of a gas comprising CO<sub>2</sub> under electroreduction conditions onto a conductive support, wherein the at least one catalytic metal comprises copper (Cu) and is electrodeposited onto the conductive support and wherein the gas is supersaturated (i.e. with CO<sub>2</sub> concentrations above the saturation limit) in the electrolyte solution and its use thereof in a reduction chemical reaction, preferably in the reduction of CO<sub>2</sub> into CO or other small molecules such as gaseous hydrocarbons (methane, ethylene) or liquid molecules (ethanol, formic acid). The invention also relates to the process of manufacture of said catalyst compound. The invention thus also relates to a process electrochemical conversion of CO<sub>2</sub> to small molecules.

IPC 8 full level

C25B 3/07 (2021.01); C25B 3/26 (2021.01); C25B 11/032 (2021.01); C25B 11/052 (2021.01); C25B 11/065 (2021.01); C25B 11/089 (2021.01); C25D 3/58 (2006.01); C25D 3/64 (2006.01); C25D 5/00 (2006.01)

CPC (source: EP)

C25B 3/07 (2021.01); C25B 3/26 (2021.01); C25B 11/032 (2021.01); C25B 11/052 (2021.01); C25B 11/065 (2021.01); C25B 11/089 (2021.01); C25D 3/58 (2013.01); C25D 3/64 (2013.01); C25D 5/003 (2013.01); C25D 5/605 (2020.08); C25D 5/617 (2020.08)

Citation (applicant)

  • WHIPPLE D TKENIS P J A: "Prospects of C02 utilization via direct heterogeneous electrochemical reduction[J", THE JOURNAL OF PHYSICAL CHEMISTRY LETTERS, vol. 1, no. 24, 2010, pages 3451 - 3458, XP055599832, DOI: 10.1021/jz1012627
  • XIA CZHU PJIANG Q ET AL.: "Continuous production of pure liquid fuel solutions via electrocatalytic C0 reduction using solid-electrolyte devices[J", NATURE ENERGY, vol. 4, no. 9, 2019, pages 776 - 785
  • HERNANDEZ SFARKHONDEHFAL M ASASTRE F ET AL.: "Syngas production from electrochemical reduction of C0 : current status and prospective implementation[J", GREEN CHEMISTRY, vol. 19, no. 10, 2017, pages 2326 - 2346
  • HORI YWAKEBE HTSUKAMOTO T ET AL.: "Electrocatalytic process of CO selectivity in electrochemical reduction of C0 at metal electrodes in aqueous media[J", ELECTROCHIMICA ACTA, vol. 39, 1994, pages 1833 - 1839, XP026551584, DOI: 10.1016/0013-4686(94)85172-7
  • BAGGER AJU WVARELA A S ET AL.: "Electrochemical C0 reduction: a classification problem[J", CHEMPHYSCHEM, vol. 18, no. 22, 2017, pages 3266 - 3273

Citation (search report)

  • [XYI] CN 112501662 A 20210316 - SHENZHEN RESEARCH INSTITUTE OF CENTRAL SOUTH UNIV
  • [Y] WO 2021102561 A1 20210603 - GOVERNING COUNCIL UNIV TORONTO [CA]
  • [XAI] GANESAN MUTHUSANKAR ET AL: "Post-supercritical CO2 electrodeposition approach for Ni-Cu alloy fabrication: An innovative eco-friendly strategy for high-performance corrosion resistance with durability", APPLIED SURFACE SCIENCE, vol. 577, 18 November 2021 (2021-11-18), AMSTERDAM, NL, pages 151955, XP055929387, ISSN: 0169-4332, DOI: 10.1016/j.apsusc.2021.151955
  • [XAI] CHUANG H C ET AL: "Material characterization in TSV fabricated by supercritical carbon dioxide electroplating", 2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 17 April 2018 (2018-04-17), pages 506 - 508, XP033354221, DOI: 10.23919/ICEP.2018.8374357

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4209619 A1 20230712

DOCDB simple family (application)

EP 22305020 A 20220111