EP 4210894 A1 20230719 - METHOD FOR SEPARATING A WORKPIECE
Title (en)
METHOD FOR SEPARATING A WORKPIECE
Title (de)
VERFAHREN ZUM TRENNEN EINES WERKSTÜCKS
Title (fr)
PROCÉDÉ DE SÉPARATION D'UNE PIÈCE
Publication
Application
Priority
- DE 102020123790 A 20200911
- EP 2021072949 W 20210818
Abstract (en)
[origin: WO2022053273A1] The invention relates to a method for separating a workpiece (1) along a separating line (10) using laser pulses (20) of a laser beam (2), preferably for cutting silicon using ultrashort pulses of an ultrashort pulse laser, particularly preferably for cutting a chip out of a silicon wafer, wherein the laser beam (2) is split into multiple sub-laser beams (26) using a beam-splitting optical unit (62), and each of the sub-laser beams (26) is focused onto the surface (12) and/or into the volume of the workpiece (1) by a focusing optical unit (64) such that the sub-laser beams (26) are arranged next to one another in a mutually spaced manner along the separating line (10), wherein material is removed by introducing the laser pulses (20) into the workpiece (1) along the separating line (10), and the sub-laser beams (26) are repeatedly moved away from their starting positions along the separating line (10) by a deflection amount and subsequently moved back to the starting positions along the separating line (10), said deflection amount being less than or equal to the spacing (L) between two adjacent sub-laser beams (26).
IPC 8 full level
B23K 26/08 (2014.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/067 (2006.01); B23K 26/364 (2014.01); B23K 103/00 (2006.01)
CPC (source: EP KR US)
B23K 26/0624 (2015.10 - EP KR US); B23K 26/0648 (2013.01 - EP KR US); B23K 26/067 (2013.01 - EP KR US); B23K 26/0876 (2013.01 - EP KR US); B23K 26/364 (2015.10 - EP KR US); B23K 2103/56 (2018.07 - EP KR)
Citation (search report)
See references of WO 2022053273A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DE 102020123790 A1 20220317; CN 116390827 A 20230704; EP 4210894 A1 20230719; KR 20230065332 A 20230511; US 11780028 B2 20231010; US 2023241711 A1 20230803; WO 2022053273 A1 20220317
DOCDB simple family (application)
DE 102020123790 A 20200911; CN 202180069547 A 20210818; EP 2021072949 W 20210818; EP 21765891 A 20210818; KR 20237012200 A 20210818; US 202318181588 A 20230310