EP 4225831 A1 20230816 - POLYAMIDE COMPOSITION
Title (en)
POLYAMIDE COMPOSITION
Title (de)
POLYAMIDZUSAMMENSETZUNG
Title (fr)
COMPOSITION POLYAMIDE
Publication
Application
Priority
- FR 2010238 A 20201007
- FR 2021051731 W 20211006
Abstract (en)
[origin: WO2022074331A1] The present invention relates to a polyamide, a composition comprising said polyamide, the use thereof, and a moulded article derived from same and its production method. The polyamide is the result of polycondensation of an acid component and an amine component, wherein the acid component comprises, per mole of acid component, from 25 to 50 mole % of at least one fatty acid dimer; from 46 to 70 mole % of at least one aliphatic diacid; and from 0 to 11 mole % of at least one chain limiting agent; and wherein the amine component comprises, per mole of amine component, from 13 to 29 mole % of at least one aliphatic diamine; and from 66 to 82 mole % of at least one cycloaliphatic diamine. The polyamide is particularly suitable for use as a hot-melt adhesive for the low-pressure and low-temperature overmoulding of a heat-sensitive battery, for example a lithium-polymer battery.
IPC 8 full level
C08G 69/26 (2006.01); B29C 45/14 (2006.01); C08G 69/34 (2006.01); C08G 69/40 (2006.01); C09J 177/06 (2006.01)
CPC (source: EP US)
B29C 45/0001 (2013.01 - EP US); B29C 45/14639 (2013.01 - EP US); C08G 69/265 (2013.01 - EP US); C08G 69/34 (2013.01 - EP); C08G 69/40 (2013.01 - EP); C08L 77/06 (2013.01 - US); C09J 5/06 (2013.01 - US); C09J 177/06 (2013.01 - EP US); B29K 2077/00 (2013.01 - EP US); B29L 2031/7146 (2013.01 - EP)
Citation (search report)
See references of WO 2022074331A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
FR 3114815 A1 20220408; FR 3114815 B1 20230428; CN 116261576 A 20230613; EP 4225831 A1 20230816; JP 2023544760 A 20231025; US 2023365752 A1 20231116; WO 2022074331 A1 20220414
DOCDB simple family (application)
FR 2010238 A 20201007; CN 202180068266 A 20211006; EP 21801156 A 20211006; FR 2021051731 W 20211006; JP 2023520390 A 20211006; US 202118030323 A 20211006