EP 4231920 A4 20240703 - MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE
Title (en)
MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE
Title (de)
ULTRASCHALLVORRICHTUNG MIT MULTIWANDLERCHIP
Title (fr)
DISPOSITIF À ULTRASONS À PUCES À TRANSDUCTEUR MULTIPLES
Publication
Application
Priority
US 2021056669 W 20211026
Abstract (en)
[origin: WO2023075756A1] An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.
IPC 8 full level
B06B 1/06 (2006.01); A61B 8/00 (2006.01); A61N 7/02 (2006.01); B06B 1/02 (2006.01); H04R 19/00 (2006.01)
CPC (source: EP KR)
A61B 8/4483 (2013.01 - EP KR); A61B 8/4494 (2013.01 - EP KR); A61N 7/02 (2013.01 - EP); B06B 1/0207 (2013.01 - EP KR); B06B 1/0629 (2013.01 - EP KR); H04R 19/00 (2013.01 - KR); A61N 2007/0052 (2013.01 - EP); B06B 2201/20 (2013.01 - EP KR); B06B 2201/76 (2013.01 - EP KR)
Citation (search report)
- [XYI] US 2019290243 A1 20190926 - BRYZEK JANUSZ [US], et al
- [XI] WO 2021079160 A1 20210429 - SINTEF TTO AS [NO], et al
- [Y] US 10835209 B2 20201117 - HAQUE YUSUF [US], et al
- [XY] YOUNGIL KIM: "2D capacitive micromachined ultrasound transducer using novel tiling based on silicon frame", MEDICAL IMAGING 2013: ULTRASONIC IMAGING, TOMOGRAPHY, AND THERAPY, vol. 8675, 29 March 2013 (2013-03-29), pages 86750E1 - 86750E7, XP093165351, Retrieved from the Internet <URL:https://www.spiedigitallibrary.org/conference-proceedings-of-spie/8675/86750E/2D-capacitive-micromachined-ultrasound-transducer-using-novel-tiling-based-on/10.1117/12.2006140.pdf> DOI: 10.1117/12.2006140
- See also references of WO 2023075756A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2023075756 A1 20230504; CN 116671130 A 20230829; EP 4231920 A1 20230830; EP 4231920 A4 20240703; JP 2024504163 A 20240130; KR 20230119723 A 20230816
DOCDB simple family (application)
US 2021056669 W 20211026; CN 202180083270 A 20211026; EP 21962691 A 20211026; JP 2023544487 A 20211026; KR 20237024804 A 20211026