Global Patent Index - EP 4239025 A1

EP 4239025 A1 20230906 - BASE-RELEASING COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME

Title (en)

BASE-RELEASING COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME

Title (de)

BASENFREISETZENDE ZUSAMMENSETZUNG UND HÄRTBARE HARZZUSAMMENSETZUNG DAMIT

Title (fr)

COMPOSITION DE LIBÉRATION DE BASE ET COMPOSITION DE RÉSINE DURCISSABLE L'UTILISANT

Publication

EP 4239025 A1 20230906 (EN)

Application

EP 21886107 A 20211025

Priority

  • JP 2020181351 A 20201029
  • JP 2021039203 W 20211025

Abstract (en)

An object of the present invention is to provide a base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions, and a curable resin composition using the same.The base-releasing composition of the present invention comprises (A) a specific side-chain crystalline (meth)acrylate copolymer and (B) a basic compound, wherein the amount of basic groups in the (B) basic compound is within a specific range and at least a portion of the Component (B) is included in the Component (A). The curable resin composition of the present invention comprises a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition described above.

IPC 8 full level

C08L 33/06 (2006.01); C08F 220/06 (2006.01); C08K 5/04 (2006.01); C09J 11/06 (2006.01); C09J 133/02 (2006.01); C09J 133/06 (2006.01)

CPC (source: EP KR US)

C08F 220/06 (2013.01 - KR); C08F 220/18 (2013.01 - KR); C08F 220/1812 (2020.02 - US); C08F 220/1818 (2020.02 - EP US); C08K 5/04 (2013.01 - KR); C08K 5/07 (2013.01 - US); C08L 33/06 (2013.01 - KR); C09J 11/06 (2013.01 - EP KR US); C09J 11/08 (2013.01 - EP); C09J 133/02 (2013.01 - KR); C09J 133/06 (2013.01 - KR); C09J 133/08 (2013.01 - EP); C09J 133/10 (2013.01 - US); C08K 5/11 (2013.01 - EP); C08K 5/17 (2013.01 - EP); C08K 5/3432 (2013.01 - EP); C08K 5/3445 (2013.01 - EP); C09J 2203/326 (2013.01 - EP); C09J 2433/00 (2013.01 - EP); H01L 27/14618 (2013.01 - US)

Citation (search report)

See references of WO 2022091989A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4239025 A1 20230906; CN 116323712 A 20230623; JP WO2022091989 A1 20220505; KR 20230096967 A 20230630; TW 202225365 A 20220701; US 2023399550 A1 20231214; WO 2022091989 A1 20220505

DOCDB simple family (application)

EP 21886107 A 20211025; CN 202180067011 A 20211025; JP 2021039203 W 20211025; JP 2022559101 A 20211025; KR 20237008270 A 20211025; TW 110139505 A 20211025; US 202118033660 A 20211025