EP 4242915 A3 20231122 - SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD INCLUDING THE SAME
Title (en)
SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD INCLUDING THE SAME
Title (de)
INTELLIGENTES IC-SUBSTRAT, INTELLIGENTES IC-MODUL UND IC-KARTE DAMIT
Title (fr)
SUBSTRAT DE CIRCUIT IMPRIMÉ INTELLIGENT, MODULE DE CIRCUIT IMPRIMÉ INTELLIGENT, ET CARTE DE CIRCUIT IMPRIMÉ LE COMPRENANT
Publication
Application
Priority
- KR 20200114507 A 20200908
- EP 21194317 A 20210901
Abstract (en)
A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: CN EP KR US)
G06K 19/0723 (2013.01 - KR); G06K 19/077 (2013.01 - KR); G06K 19/07733 (2013.01 - EP); G06K 19/07743 (2013.01 - EP); G06K 19/07745 (2013.01 - EP); G06K 19/07747 (2013.01 - EP US); G06K 19/07749 (2013.01 - EP); G06K 19/07754 (2013.01 - EP); G06K 19/07769 (2013.01 - EP); G06K 19/07775 (2013.01 - EP); G06K 19/07779 (2013.01 - US); G06K 19/07783 (2013.01 - EP); H05K 1/02 (2013.01 - CN); H05K 1/0296 (2013.01 - CN); H05K 1/115 (2013.01 - KR); H05K 1/116 (2013.01 - CN); H05K 1/165 (2013.01 - KR); H05K 1/182 (2013.01 - CN)
Citation (search report)
- [XAI] US 2015269471 A1 20150924 - FINN DAVID [IE], et al
- [A] US 2017316303 A1 20171102 - PACHLER WALTHER [AT], et al
- [A] WO 2020094320 A1 20200514 - SMART PACKAGING SOLUTIONS [FR]
- [A] WO 2015173514 A1 20151119 - LINXENS HOLDING [FR]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3968230 A1 20220316; EP 3968230 B1 20230830; CN 114158179 A 20220308; CN 114158179 B 20240329; CN 118234105 A 20240621; EP 4242915 A2 20230913; EP 4242915 A3 20231122; KR 20220032774 A 20220315; US 2022076092 A1 20220310
DOCDB simple family (application)
EP 21194317 A 20210901; CN 202111037342 A 20210906; CN 202410253592 A 20210906; EP 23184422 A 20210901; KR 20200114507 A 20200908; US 202117447020 A 20210907