EP 4245893 A1 20230920 - GOLD ELECTROPLATING SOLUTION AND ITS USE FOR ELECTRODEPOSITING GOLD WITH AN AGED APPEARANCE
Title (en)
GOLD ELECTROPLATING SOLUTION AND ITS USE FOR ELECTRODEPOSITING GOLD WITH AN AGED APPEARANCE
Title (de)
GOLDGALVANISIERUNGSLÖSUNG UND IHRE VERWENDUNG ZUR GALVANISCHEN ABSCHEIDUNG VON GOLD MIT GEALTERTEM AUSSEHEN
Title (fr)
SOLUTION D'ÉLECTRODÉPOSITION DE L'OR ET SON UTILISATION POUR L'ÉLECTRODÉPOSITION DE L'OR AVEC UN ASPECT VIEILLI
Publication
Application
Priority
EP 22305294 A 20220315
Abstract (en)
The invention relates to a gold electroplating solution comprising gold in the form of a complex with a compound of formula (I) or a salt thereof: R<sup>1</sup>S-Ar-CO<sub>2</sub>H (I)Wherein :R<sup>1</sup> is H, a C<sub>1</sub>-C<sub>6</sub> alkyl group or -S-Ar-CO<sub>2</sub>H,Ar is, at each occurrence, independently, selected from a C<sub>6</sub>-C<sub>10</sub> arylene or a 5 to 10 membered heteroarylene group, notably a phenylene, a pyridinylene, a furanylene, a pyrrolylene, or a thienylene group.
IPC 8 full level
CPC (source: EP)
Citation (applicant)
- CA 846796 A 19700714 - NOBEL FRED I, et al
- EP 0150439 A1 19850807 - LEARONAL UK PLC [GB]
- GB 1294309 A 19721025 - PMD CHEMICALS LTD
- GB 2039532 A 19800813 - INT GOLD CORP LTD
- WO 0039367 A2 20000706 - HALF TONE LIMITED [IE], et al
- GB 1526215 A 19780927 - SCHERING AG
- US 5277790 A 19940111 - MORRISSEY RONALD J [US]
- EP 1198623 A1 20020424 - HERAEUS GMBH W C [DE]
- EP 0582353 A1 19940209 - IBM [US]
Citation (search report)
- [XY] US 2007029206 A1 20070208 - ABE MIWA [JP], et al
- [XY] JP 2003226993 A 20030815 - ELECTROPLATING ENG
- [XY] US 6251249 B1 20010626 - CHEVALIER JEAN W [US], et al
- [XY] US 2017292200 A1 20171012 - HAYASHI KATSUNORI [JP]
- [X] JP H04110488 A 19920410 - ELECTROPLATING ENG
- [Y] US 2003111353 A1 20030619 - OHTANI YUTAKA [JP], et al
- [A] US 4532186 A 19850730 - SHIBAGAKI KAZUYOSHI [JP], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DOCDB simple family (application)
EP 22305294 A 20220315; EP 2023056352 W 20230313