Global Patent Index - EP 4263120 A1

EP 4263120 A1 20231025 - SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS

Title (en)

SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS

Title (de)

SINTERPASTE UND DEREN VERWENDUNG ZUM VERBINDEN VON BAUELEMENTEN

Title (fr)

PÂTE DE FRITTAGE ET UTILISATION DE CELLE-CI POUR LIER DES ÉLÉMENTS

Publication

EP 4263120 A1 20231025 (DE)

Application

EP 21749560 A 20210722

Priority

  • EP 20214425 A 20201216
  • EP 2021070543 W 20210722

Abstract (en)

[origin: WO2022128177A1] The invention relates to a sintering paste consisting of: (A) 30 to 40 wt.% of silver flakes with an average particle size ranging from 1 to 20 µm, (B) 8 to 20 wt.% of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt.% of silver(I) oxide particles, (D) 12 to 20 wt.% of at least one organic solvent, (E) 0 to 1 wt.% of at least one polymer binder, and (F) 0 to 0.5 wt.% of at least one additive differing from the components (A) to (E).

IPC 8 full level

B23K 35/02 (2006.01); B22F 1/00 (2022.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B32B 15/01 (2006.01); H01B 1/22 (2006.01); H01L 23/00 (2006.01); B23K 101/36 (2006.01); B23K 103/10 (2006.01)

CPC (source: EP US)

B22F 1/052 (2022.01 - EP); B22F 1/0545 (2022.01 - EP); B22F 1/0551 (2022.01 - EP); B22F 1/107 (2022.01 - EP); B22F 1/147 (2022.01 - EP); B22F 7/064 (2013.01 - EP); B22F 7/08 (2013.01 - EP); B23K 35/025 (2013.01 - EP US); B23K 35/3006 (2013.01 - EP US); B23K 35/3602 (2013.01 - EP); B23K 35/3613 (2013.01 - US); B32B 15/016 (2013.01 - EP); H01B 1/22 (2013.01 - EP); H01L 24/29 (2013.01 - EP); B23K 2101/36 (2018.07 - EP); B23K 2103/10 (2018.07 - EP US); H01L 2224/05639 (2013.01 - EP); H01L 2224/2929 (2013.01 - EP); H01L 2224/29294 (2013.01 - EP); H01L 2224/29339 (2013.01 - EP); H01L 2224/29386 (2013.01 - EP); H01L 2224/29493 (2013.01 - EP); H01L 2224/29499 (2013.01 - EP); H01L 2224/83048 (2013.01 - EP); H01L 2224/83055 (2013.01 - EP); H01L 2224/83065 (2013.01 - EP); H01L 2224/8309 (2013.01 - EP); H01L 2224/83097 (2013.01 - EP); H01L 2224/83203 (2013.01 - EP); H01L 2224/83424 (2013.01 - EP); H01L 2224/83447 (2013.01 - EP); H01L 2224/8384 (2013.01 - EP)

Citation (search report)

See references of WO 2022128177A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2022128177 A1 20220623; EP 4263120 A1 20231025; US 2024033860 A1 20240201

DOCDB simple family (application)

EP 2021070543 W 20210722; EP 21749560 A 20210722; US 202118257037 A 20210722