EP 4268277 A1 20231101 - DEVICE WITH A SEMI-EMBEDDED ELECTRICAL CONNECTION INSERT STEM
Title (en)
DEVICE WITH A SEMI-EMBEDDED ELECTRICAL CONNECTION INSERT STEM
Title (de)
VORRICHTUNG MIT EINEM HALBEINGEBETTETEN SCHAFT FÜR EINEN ELEKTRISCHEN VERBINDUNGSEINSATZ
Title (fr)
DISPOSITIF À TIGE D'INSERT DE CONNEXION ÉLECTRIQUE SEMI-ENTERRÉE
Publication
Application
Priority
- FR 2013975 A 20201222
- EP 2021087194 W 20211222
Abstract (en)
[origin: WO2022136497A1] The invention relates to a system provided with a microelectronics device comprising a substrate (100) exposed on one face of the device, the substrate (100) comprising at least one electrically conducting element (105) and an electrical connection member (130) in electrical continuity with the element (105) and comprising at least a stem (116) projecting from the face of the device, characterized in that the connecting member (130) comprises an inorganic anchoring portion (131) covering the element (105) and in that the stem (116) comprises a portion (1161) embedded in the anchoring portion (131) followed by a portion (1162) projecting on the face of the device.
IPC 8 full level
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC (source: EP US)
H01L 21/4853 (2013.01 - EP US); H01L 21/60 (2021.08 - US); H01L 23/49 (2013.01 - US); H01L 23/49811 (2013.01 - EP US); H01L 24/11 (2013.01 - EP); H01L 24/13 (2013.01 - EP); H01L 24/16 (2013.01 - EP); H01L 24/81 (2013.01 - EP); H01L 2224/10126 (2013.01 - EP); H01L 2224/11011 (2013.01 - EP); H01L 2224/1145 (2013.01 - EP); H01L 2224/11452 (2013.01 - EP); H01L 2224/1148 (2013.01 - EP); H01L 2224/11602 (2013.01 - EP); H01L 2224/11901 (2013.01 - EP); H01L 2224/11903 (2013.01 - EP); H01L 2224/13012 (2013.01 - EP); H01L 2224/13014 (2013.01 - EP); H01L 2224/13015 (2013.01 - EP); H01L 2224/13017 (2013.01 - EP); H01L 2224/13022 (2013.01 - EP); H01L 2224/13078 (2013.01 - EP); H01L 2224/1355 (2013.01 - EP); H01L 2224/13562 (2013.01 - EP); H01L 2224/1357 (2013.01 - EP); H01L 2224/1411 (2013.01 - EP); H01L 2224/16058 (2013.01 - EP); H01L 2224/16059 (2013.01 - EP); H01L 2224/1607 (2013.01 - EP); H01L 2224/16227 (2013.01 - EP); H01L 2224/17517 (2013.01 - EP); H01L 2224/81193 (2013.01 - EP)
C-Set (source: EP)
Citation (search report)
See references of WO 2022136497A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
FR 3118285 A1 20220624; FR 3118285 B1 20230113; CN 116711065 A 20230905; EP 4268277 A1 20231101; US 2024021502 A1 20240118; WO 2022136497 A1 20220630
DOCDB simple family (application)
FR 2013975 A 20201222; CN 202180086459 A 20211222; EP 2021087194 W 20211222; EP 21844291 A 20211222; US 202118258435 A 20211222