Global Patent Index - EP 4268986 A1

EP 4268986 A1 20231101 - HOT-STAMPED COMPONENT AND METHOD FOR MANUFACTURING SAME

Title (en)

HOT-STAMPED COMPONENT AND METHOD FOR MANUFACTURING SAME

Title (de)

HEISSGEPRÄGTE KOMPONENTE UND VERFAHREN ZUR HERSTELLUNG DAVON

Title (fr)

COMPOSANT ESTAMPÉ À CHAUD ET PROCÉDÉ DE FABRICATION DE CELUI-CI

Publication

EP 4268986 A1 20231101 (EN)

Application

EP 21915722 A 20211227

Priority

  • KR 20200185203 A 20201228
  • KR 2021019945 W 20211227

Abstract (en)

According to an aspect of the present disclosure, provided is a method of manufacturing a hot stamping component in which a residual stress analysis value satisfies a preset condition. The method includes heating a blank; forming a molded body by hot stamping the blank; and cooling the molded body to form a hot stamped component. The residual stress analysis value may be a product of a magnitude of an X-ray diffraction analysis (XRD) value obtained by quantifying residual stress by XRD analysis and a magnitude of an electron backscatter diffraction (EBSD) value obtained by quantifying an orientation by EBSD analysis, and the preset condition is about 2.85* 10<sup>-4</sup> Degree<sup>∗</sup>MPa/µm<sup>2</sup> or greater and about 0.05 Degree<sup>∗</sup>MPa/µm<sup>2</sup> or less.

IPC 8 full level

B21D 22/02 (2006.01); B21D 37/16 (2006.01); C21D 8/02 (2006.01)

CPC (source: EP US)

B21D 22/02 (2013.01 - EP); B21D 37/16 (2013.01 - EP); C21D 8/02 (2013.01 - EP); C21D 8/0252 (2013.01 - EP US); C21D 8/0273 (2013.01 - EP US); C21D 2211/008 (2013.01 - US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

US 2023107817 A1 20230406; CN 116783013 A 20230919; EP 4268986 A1 20231101; JP 2023537810 A 20230906; JP 7453424 B2 20240319; KR 102366284 B1 20220223; KR 102366284 B9 20230511; WO 2022145924 A1 20220707

DOCDB simple family (application)

US 202218077064 A 20221207; CN 202180086821 A 20211227; EP 21915722 A 20211227; JP 2022575420 A 20211227; KR 20200185203 A 20201228; KR 2021019945 W 20211227