EP 4269663 A1 20231101 - METHOD AND SYSTEM FOR ELECTROPLATING ARTICLE WITH METAL
Title (en)
METHOD AND SYSTEM FOR ELECTROPLATING ARTICLE WITH METAL
Title (de)
VERFAHREN UND SYSTEM ZUR ELEKTROPLATTIERUNG EINES ARTIKELS MIT METALL
Title (fr)
PROCÉDÉ ET SYSTÈME DE PLACAGE ÉLECTROLYTIQUE D'UN ARTICLE AVEC UN MÉTAL
Publication
Application
Priority
- JP 2020219501 A 20201228
- JP 2021044238 W 20211202
Abstract (en)
The object of the present invention is to provide a method and system for electroplating without requiring ancillary facilities or anolyte control, while using an anode which can be relatively easily produced without requiring an expensive metal or special metal. When electroplating an article with metal, decomposition of an organic compound additive in a plating bath can be suppressed by using, as an anode, a conductive substrate having a layer comprising oxide or nitride of nickel and iron formed on a surface thereof.
IPC 8 full level
C25D 17/12 (2006.01); C25D 3/56 (2006.01); C25D 5/26 (2006.01)
CPC (source: EP)
C25D 3/562 (2013.01); C25D 3/565 (2013.01); C25D 5/50 (2013.01); C25D 5/67 (2020.08); C25D 7/0642 (2013.01); C25D 17/10 (2013.01); C25D 21/00 (2013.01); C25D 21/14 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4269663 A1 20231101; CN 116670334 A 20230829; JP WO2022145170 A1 20220707; TW 202233528 A 20220901; WO 2022145170 A1 20220707
DOCDB simple family (application)
EP 21915031 A 20211202; CN 202180087593 A 20211202; JP 2021044238 W 20211202; JP 2022572947 A 20211202; TW 110147947 A 20211221