Global Patent Index - EP 4279627 A4

EP 4279627 A4 20240807 - INJECTION MOLDED ALLOY MATERIAL AND PROCESSING METHOD

Title (en)

INJECTION MOLDED ALLOY MATERIAL AND PROCESSING METHOD

Title (de)

SPRITZGEGOSSENES LEGIERUNGSMATERIAL UND VERARBEITUNGSVERFAHREN

Title (fr)

MATÉRIAU D'ALLIAGE MOULÉ PAR INJECTION ET PROCÉDÉ DE TRAITEMENT

Publication

EP 4279627 A4 20240807 (EN)

Application

EP 22919269 A 20221230

Priority

  • CN 202210325044 A 20220330
  • CN 2022144213 W 20221230

Abstract (en)

[origin: EP4279627A1] This application provides an injection molded alloy material and a processing method, so as to improve strength of the alloy material, thin a structure of a terminal product, reduce production costs of the product, and improve production efficiency of the product. The injection molded alloy material includes the following components: carbon (C) occupying ≦ 0.10% of a total weight of the alloy material, nickel (Ni) occupying 4.5-8.5% of the total weight of the alloy material, chromium (Cr) occupying 5.5-9.5% of the total weight of the alloy material, molybdenum (Mo) occupying 4.5-7.5% of the total weight of the alloy material, cobalt (Co) occupying 13.0-18.0% of the total weight of the alloy material, vanadium (V) occupying ≦ 1.0% of the total weight of the alloy material, and a remaining component of iron (Fe).

IPC 8 full level

C22C 33/02 (2006.01); B22F 1/05 (2022.01); B22F 3/10 (2006.01); B22F 3/22 (2006.01); B22F 3/24 (2006.01); C21D 1/26 (2006.01); C21D 1/613 (2006.01); C21D 1/76 (2006.01); C21D 1/773 (2006.01); C21D 6/00 (2006.01); C21D 6/02 (2006.01); C21D 6/04 (2006.01); C21D 9/00 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/52 (2006.01)

CPC (source: CN EP)

B22F 1/05 (2022.01 - EP); B22F 3/10 (2013.01 - EP); B22F 3/1021 (2013.01 - EP); B22F 3/1025 (2013.01 - CN EP); B22F 3/225 (2013.01 - CN EP); B22F 3/24 (2013.01 - CN EP); C21D 1/00 (2013.01 - CN); C21D 1/26 (2013.01 - EP); C21D 1/613 (2013.01 - EP); C21D 1/76 (2013.01 - EP); C21D 1/773 (2013.01 - CN EP); C21D 6/004 (2013.01 - EP); C21D 6/007 (2013.01 - EP); C21D 6/02 (2013.01 - EP); C21D 6/04 (2013.01 - CN EP); C21D 9/0068 (2013.01 - EP); C22C 33/0285 (2013.01 - EP); C22C 38/004 (2013.01 - CN); C22C 38/44 (2013.01 - CN EP); C22C 38/46 (2013.01 - CN EP); C22C 38/52 (2013.01 - CN EP); B22F 2003/248 (2013.01 - CN EP); C21D 2261/00 (2013.01 - EP)

C-Set (source: EP)

  1. B22F 2998/10 + B22F 1/10 + B22F 3/225 + B22F 3/1025 + B22F 3/1021 + B22F 2003/248
  2. B22F 2999/00 + B22F 2003/248 + B22F 2202/03
  3. B22F 2999/00 + B22F 3/1017 + B22F 2201/20 + B22F 2201/02 + B22F 2201/11

Citation (search report)

  • [I] CN 114086055 A 20220225 - HUAWEI TECH CO LTD, et al
  • [A] CN 111299589 A 20200619 - JIANGSU GIAN TECH CO LTD
  • [A] CN 113969378 A 20220125 - VIVO MOBILE COMMUNICATION CO LTD
  • [T] WEBB P A: "Volume and Density Determinations for Particle Technologists", INTERNET CITATION, 1 February 2001 (2001-02-01), pages 1 - 15, XP002495931, Retrieved from the Internet <URL:http://www.micromeritics.com/pdf/app_articles/density_determinations.pdf> [retrieved on 20080915]
  • See also references of WO 2023185176A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4279627 A1 20231122; EP 4279627 A4 20240807; CN 116926440 A 20231024; WO 2023185176 A1 20231005

DOCDB simple family (application)

EP 22919269 A 20221230; CN 202210325044 A 20220330; CN 2022144213 W 20221230